Datasheet
Features
Common anode
Small 1.6 x 1.5 x 0.35 mm package
Di used optics
Red/Green/Blue color combination
Available in 8 mm tape on 7" diameter reels
High brightness using AlInGaP and InGaN die technology
Compatible with re ow soldering
Applications
Backlighting
Status indicator
Front panel indicator
O ce automation, home appliances, industrial
equipment
Description
The HSMF-C114 tricolor chip-type LED is designed in an
ultra small package for miniaturiza-tion. It is the rst of its
kind to achieve such small packaging and be the thinnest
package in the industry for tricolor package. With the free-
dom to have any combination of colors from mixing of the
3 primary colors, this will yield a wide variety of colors to
suit every application and product theme.
The small size, narrow footprint, and low pro le make
this LED excellent for back-lighting, status indication, and
front panel illumination applications.
In order to facilitate pick and place operation, this ChipLED
is shipped in tape and reel, with 4000 units per reel. The
package is compatible with re ow soldering and binned
by both color and intensity.
HSMF-C114
Surface Mount Tricolor ChipLEDs
Data Sheet
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.







