Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED (multi-colour) Non-standard Red, Green-yellow, Blue 80 mcd, 50 mcd, 60 mcd 125 ° 20 mA, 20 mA, 20 mA 1.9 V, 2 V,

Device Selection Guide

CAUTION: HSMF-C113 and HSMF-C115 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate

precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.

Part Number Color Package Description

HSMF-C113 AlInGaP Red / AlInGaP Green / InGaN Blue Untinted, Diused

HSMF-C115 AlInGaP Red / InGaN Green / InGaN Blue Untinted, Diused

HSMF-C113 / C115

Right Angle Tricolor Surface Mount ChipLEDs

Data Sheet

Features

• Common anode

• Small 2.5 x 1.0 x 1.0 mm package

• Diused optics

• Available in 8 mm tape on 7" diameter reels

• High brightness using AlInGaP and InGaN die

technology

• Compatible with reow soldering

Applications

• Backlighting

• Status indicator

• Front panel indicator

• Oce automation, home appliances, industrial

equipment

Description

The HSMF-C113 / C115 tricolor chip-type LED is designed

in an ultra small package for miniaturization. It is the rst

of its kind to achieve such small packaging for 3 dies. With

the freedom to have any combination of colors from mix-

ing of the 3 primary colors, this will yield a wide variety of

colors to suit every application and product theme.

The small size, narrow footprint, and low prole make

this LED excellent for back-lighting, status indication, and

front panel illumination applications.

In order to facilitate pick and place operation, this

ChipLED is shipped in tape and reel, with 3000 units per

reel. The package is compatible with reow soldering and

binned by both color and intensity.

Summary of content (8 pages)

PAGE 1
HSMF-C113 / C115 Right Angle Tricolor Surface Mount ChipLEDs Data Sheet Description Features The HSMF-C113 / C115 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme.
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Package Dimensions LED Dies 1.00 [.039] 2.50 [.098] R0.50 [.020] 2.10 [.083] 0.50 [.020] 1.00 [.039] Anode Mark 0.50 [.020] 1 0.35 [.014] 2 3 0.40 [.016] 4 0.35 [.014] 0.50 [.020] 0.30 [.012] 0.30 [.012] 0.35 [.014] 0.35 [.014] Notes: 1. All Dimensions in millimeteres (inches) 2. Tolerance is ±0.1mm (±0.
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Absolute Maximum Ratings at TA = 25°C Parameter AlInGaP Red AlInGaP Green InGaN Green InGaN Blue Units DC Forward Current[1,3] 20 20 20 20 mA Power Dissipation[1] 48 52 78 78 mW DC Forward Current[2] 15 15 15 15 mA Power Dissipation[2] 36 39 59 59 mW Reverse Voltage (IR = 100mA) 5 5 5 5 V LED Junction Temperature 95 95 95 95 °C Operating Temperature Range -30 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature See IR soldering profile (Fig
PAGE 4
AlInGaP Red Color Bin Limits[1] CAUTION: 1. The above optical performance specifications are valid in the case when single LED is lit up. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than 1 LED is lit. 3. Please refer to Avago Technologies Application Brief AB D-007 for additional details / explanation on driving the part in parallel circuit. Dom.
PAGE 5
100 InGaN Blue RELATIVE INTENSITY 90 80 AlInGaP Green InGaN Green AlInGaP Red 70 60 50 40 30 20 10 0 400 450 500 550 WAVELENGTH - nm 600 650 700 Figure 1. Relative intensity vs. wavelength. 1.2 AlInGaP Green AlInGaP Red InGaN Green & Blue 10 LUMINOUS INTENSITY (NORMALIZED AT 20mA) IF - FORWARD CURRENT - mA 100 1 0.1 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 1.2 20 1 RELATIVE INTENSITY AlInGaP 0.4 0.
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10 SEC. MAX. 10 - 30 SEC. 4˚C/SEC. MAX. 140-160˚C -3˚C/SEC. 4˚C/SEC. MAX. TEMPERATURE TEMPERATURE 230˚C MAX. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 6. Recommended reflow soldering profile. (Acc. to J-STD-020C) Figure 7. Recommended Pb-free reflow soldering profile. EMITTING DIRECTION 0.4 0.85 0.10 0.90 0.50 0.45 1.80 Figure 8. Recommended soldering land pattern. Notes: 1.
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8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Figure 10. Reel dimensions. 4.00 [0.157] DIM. C [SEE TABLE 1] 1.50 [0.059] 0.254 ± 0.05 [0.010 ± 0.002] 1.75 [0.069] 3.50 ± 0.05 [0.138 ± 0.002] DIM. A [SEE TABLE 1] 8.00 ± 0.30 [0.315 ± 0.012] DIM. B [SEE TABLE 1] 2.00 ± 0.05 [0.079 ± 0.
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END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 12. Tape leader and trailer dimensions. Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components.