Datasheet

9
Figure 6. Recommended reflow soldering profile.Figure 5e. Relative intensity vs. angle for HSMx-C265.
Figure 8. Recommended soldering pattern for HSMx-C265.
Figure 9. Recommended soldering pattern for HSMx-C120.
Figure 10. Recommended soldering pattern for HSMx-C110.
Figure 11. Recommended soldering pattern
for HSMx-C170 and HSMx-C177.
Figure 12. Recommended soldering pattern
for HSMx-C190, HSMx-C191 and HSMx-C197.
Figure 13. Recommended soldering pattern
for HSMx-C150.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50
-30 0 20 30 507090-90 -20-80 -60 -40 -10 10 40 60 80
1.25 (0.049)
1.4
(0.055)
1.4
(0.055)
2.3
(0.091)
2.2 (0.087) DIA. PCB HOLE
0.7 (0.028)
0.8
(0.031)
0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 7. Recommended Pb-free reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
TIME
TEMPERATURE