Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED 0603 Green-yellow 52 mcd 155 ° 20 mA 2.1 V

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Features

• Small size

• Industry standard footprint

• Operating temperature range of –30˚C to +85˚C

• Compatible with IR soldering

• Available in 8 mm tape on 7" diameter reel

• Reel sealed in zip-locked moisture barrier bags

Applications

• Membrane switch indicator

• LCD backlighting

• Pushbutton backlighting

• Front panel indicator

• Symbol backlighting

• Keypad backlighting

Description

This chip-type LED utilizes Aluminum Indium Gallium

Phosphide (AlInGaP) material technology. The AlInGaP

material has a very high luminous efficiency, capable

of producing high light output.

These chipLEDs come in top mounting, top emitting

packages (HSMx-C150/170/177/190/191/197), top

mounting, side emitting packages (HSMx-C110/120)

or reverse mounting, top emitting package (HSMx-

C265).

All packages are binned by both color and intensity.

In order to facilitate pick and place operation, these

chipLEDs are shipped in Tape & Reel, with 4000 units

per reel for HSMx-C120/170/ 177/190/191/197 and

3000 units per reel for HSMx-C110/C150/265.

These packages are compatible with reflow soldering

process.

HSME-Cxxx

AlInGaP Green ChipLED

Data Sheet

HSME-C110/C120/C150/C170/

C177/C190/C191/C197/C265

CAUTION: HSME-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions

during handling and processing. Refer to Application Note AN-1142 for additional details.

Summary of content (12 pages)

PAGE 1
HSME-Cxxx AlInGaP Green ChipLED Data Sheet HSME-C110/C120/C150/C170/ C177/C190/C191/C197/C265 Description This chip-type LED utilizes Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output. These chipLEDs come in top mounting, top emitting packages (HSMx-C150/170/177/190/191/197), top mounting, side emitting packages (HSMx-C110/120) or reverse mounting, top emitting package (HSMxC265).
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Package Dimensions CATHODE LINE LED DIE CATHODE MARK 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 3.2 (0.126 ) 2.00 (0.079 ) POLARITY CLEAR EPOXY 1.40 (0.055) DIFFUSED EPOXY POLARITY 1.5 (0.059) 0.30 (0.012) PC BOARD PC BOARD 1.6 (0.063 ) 0.80 (0.031) 0.30 (0.012) 0.5 (0.020) CATHODE LINE 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C110 HSMx-C170 CATHODE MARK CATHODE MARK 0.8 (0.
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CATHODE MARK 3.40 (0.134) CATHODE MARK (ETCHED) LED DIE 1.6 (0.063) 1.25 (0.049) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD POLARITY 1.20 (0.047) UNDIFFUSED EPOXY 2– 1.10 (0.043) 1.10 (0.043) PC BOARD 0.5 (0.020) CATHODE LINE 0.30 (0.012) 0.5 ± 0.2 (0.020 ± 0.008) 0.5 ± 0.2 (0.020 ± 0.008) CATHODE LINE 2– 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL HSMx-C265 HSMx-C150 CATHODE MARK LED DIE CATHODE MARK 0.6 (0.024) 0.80 (0.031) 1.6 (0.
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Package Dimensions, continued CATHODE MARK 1.25 (0.049) 2.00 (0.079) POLARITY DIFFUSED EPOXY 0.40 (0.016) PC BOARD 0.16 (0.006) 0.40 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.10 (0.043) SOLDERING TERMINAL HSMx-C177 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
PAGE 5
Device Selection Guide Package Dimension (mm)[1,2] AlInGaP Green Package Description 1.6 (L) x 0.8 (W) x 0.6 (H) HSME-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.4 (H) HSME-C197 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.8 (H) HSME-C190 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.8 (H) HSME-C170 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.4 (H) HSME-C177 Untinted, Diffused 1.6 (L) x 1.0 (W) x 0.6 (H) HSME-C120 Untinted, Non-diffused 3.2 (L) x 1.5 (W) x 1.
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Optical Characteristics at TA = 25°C Part Number Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength λpeak (nm) Typ. Color, Dominant Wavelength λd[2] (nm) Typ. Viewing Angle Luminous Efficacy 2 θ1/2 Degrees[3] ηV (lm/w) Typ. Typ. HSME-C110 18 52 570 572 130 570 HSME-C120 18 52 570 572 155 570 HSME-150/170/ 18 190/191 50 570 572 170 570 HSME-C177/197 18 50 570 572 130 570 HSME-C265 50 570 572 150 570 18 Notes: 1.
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100 80 70 60 50 40 30 20 10 0 400 450 500 550 600 650 10 1 0.1 1.5 1.6 700 1.7 1.8 1.9 Figure 1. Relative intensity vs. wavelength. 0.8 0.6 0.4 0.2 0 5 10 15 20 25 30 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. 100 25 RELATIVE INTENSITY – % 90 20 15 10 5 80 70 60 50 40 30 20 10 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 ANGLE TA – AMBIENT TEMPERATURE – °C Figure 5a.
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RELATIVE INTENSITY – % 100 80 60 40 20 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 20 40 60 80 100 ANGLE RELATIVE INTENSITY – % 100 80 60 40 20 0 -100 -80 -60 -40 -20 0 ANGLE Figure 5c. Relative intensity vs. angle for HSMx-C110.
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100 80 70 60 10 SEC. MAX. 50 TEMPERATURE RELATIVE INTENSITY – % 90 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 230°C MAX. 4°C/SEC. MAX. 140-160°C –3°C/SEC. 4°C/SEC. MAX. 10 20 30 40 50 60 70 80 90 OVER 2 MIN. TIME ANGLE Figure 5e. Relative intensity vs. angle for HSMx-C265. Figure 6. Recommended reflow soldering profile. TEMPERATURE 10 - 30 SEC. 255 - 260 °C 3 °C/SEC. MAX. 217 °C 200 °C 2.2 (0.087) DIA. PCB HOLE 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 1.25 (0.049) 100 SEC. MAX.
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USER FEED DIRECTION CATHODE SIDE xx xxxxxx xxxxx xxxxx xxxxx xx PRINTED LABEL Figure 14. Reeling orientation. ; ;; ;; ;; ;; ;;; ;; 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 15. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 10 6 PS 5.0 ± 0.5 (0.197 ± 0.
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;; ;;;;;; ;;; ;;;;;;; ;; ;;;;;; 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) ;;; ;;; CARRIER TAPE USER FEED DIRECTION 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) HSMx-C110/C120 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.
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END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Convective IR Reflow Soldering For more information on soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 17. Tape leader and trailer dimensions.