Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED 1005 Red 90 mcd 130 ° 20 mA 1.9 V

Features

 Extremely small size (1.0 x 0.5 x 0.4 mm)

 0402 industry standard footprint

 Di used optics

 Operating temperature range of –40°C to +85°C

 Compatible with IR soldering

 Available in 6 colors

 Available in 8 mm paper tape on 7" diameter reel

 Reel sealed in zip locked moisture barrier bags

Applications

 LCD backlighting

 Push button backlighting

 Front panel indicator

 Symbol backlighting

 Keypad backlighting

Description

The HSMx-C280 ChipLEDs are designed to 0402 (1.0 x 0.5

mm) industry standard footprint. They are extremely small

in size and the low 0.4 mm height makes them very suit-

able for application in small portable hand held devices

where real estate is a premium.

Six di erent colors are available: green, red, yellow,

amber, and deep red. All parts are color and inten-

sity binned except red color. They come in 8 mm paper

tape on a 7 inch diameter reel with 4000 units per

reel which makes them compatible for automatic

placement.

Device Selection Guide

AS AlInGaP

Product Number Color Package Description

HSMA-C280 Amber Untinted, Di used

HSMC-C280 Red Untinted, Di used

HSMT-C280 Deep Red Untinted, Di used

GaP

Product Number Color Package Description

HSMG-C280 Green Untinted, Di used

HSMS-C280 HER Untinted, Di used

HSMY-C280 Yellow Untinted, Di used

HSMx-C280

Miniature ChipLED

Data Sheet

CAUTION: HSMx-C280 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate

precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

Summary of content (8 pages)

PAGE 1
HSMx-C280 Miniature ChipLED Data Sheet Description Features The HSMx-C280 ChipLEDs are designed to 0402 (1.0 x 0.5 mm) industry standard footprint. They are extremely small in size and the low 0.4 mm height makes them very suitable for application in small portable hand held devices where real estate is a premium.         Six different colors are available: green, red, yellow, amber, and deep red. All parts are color and intensity binned except red color.
PAGE 2
Package Dimensions LED DIE CATHODE MARK 0.5 (0.02) 1.0 (0.04) 0.25 (0.01) POLARITY DIFFUSED EPOXY 0.4 (0.016) PC BOARD 0.16 (0.006) CATHODE LINE 0.30 (0.012) 0.30 (0.012) 0.4 (0.016) MIN. SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
PAGE 3
Absolute Maximum Ratings at TA = 25˚C Parameter HSMA/C/T-C280 HSMG/S/Y-C280 Units DC Forward Current [1] 25 20 mA Power Dissipation 60 52 mW Reverse Voltage (IR = 100 μA) 5 5 V LED Junction Temperature 95 95 ˚C Operating Temperature Range –40 to +85 –40 to +85 ˚C Storage Temperature Range –40 to +85 –40 to +85 ˚C Soldering Temperature See IR soldering profile (Figure 6 & 7) Notes: 1. Derate linearly as shown in Figure 4.
PAGE 4
Color Bin Limits[1] Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Green Color Bins [1] Dom. Wavelength (nm) Min. Max. Bin ID Min. Max. A 0.11 0.18 A 561.5 564.5 B 0.18 0.29 B 564.5 567.5 C 0.29 0.45 C 567.5 570.5 D 0.45 0.72 D 570.5 573.5 E 0.72 1.10 E 573.5 576.5 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 Bin ID Dom. Wavelength (nm) Min. Max. L 11.20 18.00 A 582.0 584.5 M 18.00 28.50 B 584.5 587.0 N 28.50 45.
PAGE 5
1.0 AS RED AS AMBER 90 80 AS DEEP RED 70 AS ORANGE 60 50 40 30 GaP GREEN 0.8 RELATIVE INTENSITY RELATIVE INTENSITY - % 100 20 HER GaP YELLOW 0.6 0.4 0.2 10 550 600 650 WAVELENGTH 0 700 Figure 1a. Relative intensity vs. wavelength. 550 575 10 HER LPE GREEN GaP YELLOW 1 600 1.4 1.2 1.2 1.0 0.8 0.6 GaP 0.4 0 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 725 700 1.0 0.8 AS AMBER 0.6 AS RED and DEEP RED 0.4 0.2 0 0 5 10 15 20 25 30 0 5 10 15 Figure 3. Luminous intensity vs.
PAGE 6
10 - 30 SEC. TEMPERATURE TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C –3°C/SEC. M 4°C/SEC. MAX. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 ° C/SEC. MAX. 150 °C 3 ° C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 6. Recommended reflow soldering profile. (Acc. to J-STD-020C) Figure 7. Recommended Pb-free reflow soldering profile. USER FEED DIRECTION 0.5 (0.02) CATHODE SIDE 0.5 (0.02) 0.5 (0.02) 0.5 (0.02) PRINTED LABEL Figure 8.
PAGE 7
DIM. C (SEE TABLE 1) 4.00 (0.157) CATHODE 1.50 (0.059) 0.23 ± 0.05 (0.009 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 4.00 (0.157) COVER TAPE USER FEED DIRECTION 2.00 ± 0.05 (0.079 ± 0.002) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER HSMx-C280 SERIES 1.10 (0.043) Figure 11. Tape dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.
PAGE 8
Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.