Datasheet

8
Baking Conditions ChartHSDL-9100 Moisture Proof Packaging
All HSDL-9100 options are shipped in moisture proof
package. Once opened, moisture absorption begins.
This part is compliant to JEDEC Level 3.
Baking Conditions
If the parts are not stored in dry conditions, they must
be baked before reflow to prevent damage to the parts.
Package Temp Time
In reels 60 °C t 48hours
In bulk
100 °C
t4hours
125 °C
t 2 hours
Baking should only be done once.
Recommended Storage Conditions
Storage Temperature 10°C to 30°C
Relative Humidity below 60% RH
Time from unsealing to soldering
After removal from the bag, the parts should be soldered
within seven days if stored at the recommended storage
conditions.
Figure 7. Baking conditions chart
Environment
less than 30 deg C,
and less than
60% RH
Yes
No
No
Yes
Perform Recommended
Baking Conditions
Package Is
Opened (Unsealed)
Units in A Sealed
Moisture-Proof
Package
No Baking
Is Necessary
Package Is
Opened less
Than 168 hours