Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesLED wired Amber Circular 3 mm 96.2 mcd 60 ° 20 mA 2.02 V

Description

This family of 3 mm LED Lamps is capable of withstand-

ing automatic insertion and wave soldering processes.

Designed with a thick epoxy ange and soft leadframe

material, it is ideal for clinch and cut operations.

Applications

• General purpose

• High volume manufacturing

Device Selection Guide

High Brightness Lamps

Part Number Color Package lens Luminous Intensity,

Min. Iv @ 20 mA

Viewing Angle,

2θ

1/2

Package Drawing

HLMP-NG05 AlInGaP Red Micro-tinted 90.2

45°

HLMP-NG07 AlInGaP Red Micro-tinted 90.2

60°

HLMP-NL06 AlInGaP Amber Micro-tinted 96.2

60°

High Eciency Lamps

Part Number Color Package lens Luminous Intensity,

Min. Iv @ 10 mA

Viewing Angle,

2θ

1/2

Package Drawing

HLMP-N305 GaP Yellow Tinted 14.7

45°

Note:

1. 2θ

is the o axis angle where the luminous intensity is

the on axis intensity.

HLMP-N305, HLMP-NG0x, HLMP-NL06

T-1 (3 mm) Auto Insertable LED Lamps

Data Sheet

Features

• T-1 (3 mm) auto-insertable package

• High brightness light output

• Tinted non-diused lens

• Wide viewing angle

• Available colors: Red, Amber and Yellow

• Available with straight or formed lead tape and reel

options

Summary of content (11 pages)

PAGE 1
HLMP-N305, HLMP-NG0x, HLMP-NL06 T-1 (3 mm) Auto Insertable LED Lamps Data Sheet Description Features This family of 3 mm LED Lamps is capable of withstanding automatic insertion and wave soldering processes. • T-1 (3 mm) auto-insertable package Designed with a thick epoxy flange and soft leadframe material, it is ideal for clinch and cut operations.
PAGE 2
Package Dimensions Package Drawing “A” SEATING PLANE 23.0 (0.91) 5.9 ± 0.5 (0.23 ± 0.02) 1.0 ± 0.5 (0.04 ± 0.02) 3.5 ± 0.3 (0.14 ± 0.01) CATHODE MARKS 0.65 (0.03) MAX. 0.4 ± 0.2 (0.02 ± 0.01) 4.4 ± 0.3 3.1 ± 0.2 (0.17 ± 0.01) (0.12 ± 0.01) 2.5 ± 0.3 (0.10 ± 0.01) 0.4 ± 0.2 (0.01 ± 0.01) + 0.1 0.4 0 + 0.00 (0.2 - 0.00 ) 0.45 ± 0.10 (0.02 ± 0.007) 2.0 (0.08) REF. 3.4 0.2 (0.13 0.01) Package Drawing “B” 1.0 MIN. 23.0 MIN. 5.70 ± 0.5 3.50 ± 0.30 CATHODE FLAT 0.65 MAX. CATHODE LEAD 3.80 ± 0.
PAGE 3
Absolute Maximum Ratings at TA = 25 ºC AlInGaP Parameter Yellow Amber & Red Units DC Forward Current[1] 20 mA Reverse Voltage (Ir = 100 µA) 5 V Junction Temperature, Tjmax 110 °C Storage Temperature Range -40 to +85 °C Operating Temperature Range -20 to +85 °C 30[2,3] -40 to +85 Notes: 1. See Figure 4 for maximum current derating vs. ambient temperature. 2. Suggested minimum DC current: 10 mA. 3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average.
PAGE 4
HIGH BRIGHTNESS LAMPS 1 AlInGaP AMBER 0.9 AlInGaP RED RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 500 550 600 WAVELENGTH – nm 650 700 HIGH EFFICIENCY LAMPS RELATIVE INTENSITY 1.0 0.5 YELLOW 0 500 550 600 650 700 WAVELENGTH – nm Figure 1. Relative intensity vs. peak wavelength. HIGH BRIGHTNESS LAMPS 50 HIGH EFFICIENCY LAMPS 90 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA 80 40 30 AlInGaP RED 20 AlInGaP AMBER 10 70 60 50 YELLOW 40 30 20 10 0 0 0.5 1.0 1.5 2.
PAGE 5
HIGH BRIGHTNESS LAMPS 2.0 YELLOW 4.0 1.5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 3.5 AlInGaP 1.0 0.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 20 40 30 IF – DC FORWARD CURRENT – mA AlInGaP IF – FORWARD CURRENT – mA 35 30 25 RqJA = 500° C/W 20 RqJA = 650° C/W RqJA = 750° C/W 15 10 5 0 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward DC current vs. ambient temperature.
PAGE 6
1 0.9 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 40 50 60 70 80 90 ANGULAR DISPLACEMENT – DEGREES Figure 5. Representative spatial radiation pattern for 45° viewing angle. 1 0.9 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 ANGULAR DISPLACEMENT – DEGREES Figure 6. Representative spatial radiation pattern for 60° viewing angle.
PAGE 7
Intensity Bin Limits Amber Color Bin Limits Bin Intensity Range (mcd) Min. Max. (nm at 20 mA) H 13.8 27.6 Bin Name Min. Max. 1 584.5 587.0 I 22.0 44.0 2 587.0 589.5 J 35.2 70.4 4 589.5 592.0 K 56.4 112.8 6 592.0 594.5 L 90.2 180.4 M 138.0 276.0 N 200.0 400.0 O 290.0 580.0 Red/Orange P 500.0 1000.0 /Red-Orange Q 700.0 1400.0 R 1000.0 2000.0 S 1400.0 2800.0 T 2000.0 4000.0 U 2900.0 5800.0 V 4200.0 8400.0 W 6000.0 12000.0 X 8700.0 17400.
PAGE 8
Color Categories Color Yellow Category # Lambda (nm) Min. Max. 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Tolerance for each bin limit is ±0.5 nm. Taping Options Straight Lead Option #002 #2CA #2CD Dimension “B” – – – Dimension “H” 20.5 ± 1.0 (0.81 ± 0.04) 18.0 ± 1.0 (0.71 ± 0.04) 20.5 ± 1.0 (0.81 ± 0.04) Formed Lead Option #2UK #2UL #2UM #2UN #2UP #2UQ #2UR Dimension “B” 12.0 ± 1.0 (0.47 ± 0.04) 9.0 ± 1.0 (0.35 ± 0.
PAGE 9
Tape Outline Drawing 6.4 ± 1.3 (0.25 ± 0.05) 0.0 ± 1.0 (0.00 ± 0.04) 12.7 ± 1.0 (0.50 ± 0.04) CATHODE LEAD 5.1 ± 0.7 (0.20 ± 0.03) DIMENSION "H" (SEE TABLE) 2.5 (0.10) MAX. 18.0 ± 1.0 (0.71 ± 0.04) 14.0 ± 1.7 (0.55 ± 0.07) 11.0 MAX. (0.43) 9.1 ± 0.6 (0.36 ± 0.03) 2.5 ± 0.3 (0.10 ± 0.01) 12.7 ± 0.3 (0.50 ± 0.01) A A ∅ 4.0 ± 0.2 TYP. (0.16 ± 0.01) VIEW A–A 0.7 ± 0.2 (0.03 ± 0.01) Straight Lead 6.4 ± 1.3 (0.25 ± 0.05) 0.0 ± 1.0 (0.00 ± 0.04) 12.7 ± 1.0 (0.50 ± 0.
PAGE 10
Recommended Assembly Condition Package Options Lead Option Ammo Pack (1000 pcs.) Tape & Reel (2000 pcs.) Straight Lead #2C — #002 Formed Lead #2U — – AMMO PACK (for All options except #002) • A single-sided phenolic printed circuit board (PCB) is preferred. Double-sided PCB and other materials may cause greater lead stress. Recommended throughhole diameter is 0.98 to 1.08 mm. Leadlength below the PCB should be 1.5 to 2.
PAGE 11
Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.