Datasheet

6
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
9.125±0.625
0.3593±0.025
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
0.70±0.20
0.276±0.0079
20.5±1.00
0.8071±0.0394
12.70±1.00
0.50±0.0394
CATHODE
View A-A
0.70±0.20
0.276±0.0079
4.00±0.20
0.1575±0.0079
Ø
TYP.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60 sec Max
TIME (sec)
260°C Max
105°C Max
TEMPERATURE (°C)