Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesLED wired Red Oval 3 x 4 mm 1380 mcd 50 °, 100 ° 20 mA 2.3 V

HLMP-LG65-xxxxx

Precision Optical Performance Red

New 4mm Standard Oval LEDs

Data Sheet

7.26±0.20

0.286±0.008

10.00±0.50

0.394±0.020

3.80±0.20

0.1496±0.008

1.25±0.20

0.049±0.008

0.45

0.018

2.54±0.30

0.100±0.012

1.0

0.039

3.00±0.20

0.118±0.008

MIN.

+0.10

- 0.04

+0.004

- 0.002

0.80

0.031

MAX. EPOXY MENISCUS

CATHODE LEAD

NOTE 1

21.0

0.827

MIN.

Notes:

All dimensions in millimeters (inches).

Tolerance is ± 0.20mm unless other speciﬁed

Description

This Precision Optical Performance Oval LED is speciﬁcally

designed for full color/video and passenger information

signs. The oval shaped radiation pattern and high lumi-

nous intensity ensure that these devices are excellent

for wide ﬁeld of view outdoor applications where a wide

viewing angle and readability in sunlight are essential.

The package epoxy contains both UV-A and UV-B inhibi-

tors to reduce the eﬀects of long term exposure to direct

sunlight.

Package Dimensions

Features

x Well defined spatial radiation pattern

x High brightness material

x Superior resistance to moisture

x Standoff Package

x Red Tinted Diffused

x Typical viewing angle 50° x100°

Applications

x Full color signs

Summary of content (8 pages)

PAGE 1
HLMP-LG65-xxxxx Precision Optical Performance Red New 4mm Standard Oval LEDs Data Sheet Description Features This Precision Optical Performance Oval LED is speciﬁcally designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide ﬁeld of view outdoor applications where a wide viewing angle and readability in sunlight are essential.
PAGE 2
Device Selection Guide Part Number Color and Dominant Wavelength λd (nm) Typ Luminous Intensity Iv (mcd) at 20 mA-Min [1] Luminous Intensity Iv (mcd) at 20 mA-Max [1] HLMP-LG65-TX0DD Red 626 800 1990 Tolerance for each intensity limit is ± 15%. Note: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
PAGE 3
1 100 0.8 80 FORWARD CURRENT - mA RELATIVE INTENSITY AlInGaP Red 0.6 0.4 0.2 600 650 WAVELENGTH - nm I F MAX . - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 0 20 40 60 DC FORWARD CURRENT - mA 80 100 Figure 5. Radiation pattern-Major Axis 60 50 40 30 20 10 0 0 20 40 60 80 100 Figure 4. Maximum Forward Current vs Ambient Temperature NORMALIZED INTENSITY -30 0 30 ANGULAR DISPLACEMENT-DEGREE 3 TA - AMBIENT TEMPERATURE - C Figure 3.
PAGE 4
0.3 FORWARD VOLTAGE SHIFT - V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) 10 1 0.2 0.1 0 -0.1 -0.2 -0.3 0.1 -40 -0.4 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 120 -40 140 -20 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 120 Figure 7. Relative Light Output vs Junction Temperature Figure 8. Relative Forward Voltage Shift vs Junction Temperature Intensity Bin Limit Table (1.
PAGE 5
Precautions: Lead Forming: x The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. x If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package.
PAGE 6
Example of Wave Soldering Temperature Proﬁle for TH LED 260°C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin ﬂux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105°C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be suﬃciently cooled to room temperature before exerting mechanical force. TIME (sec) Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.
PAGE 7
Packaging Box for Ammo Packs From left side of box adhesive tape must be facing upwards Label on this side of box A + O OGIES G A V A HNOL TEC ode Cath_ e Anod Anode lead leaves the box r- st C el r Lab e Moth Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LP
PAGE 8
(ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Deﬁnition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins a