Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesLED wired Red Circular 3 mm 3 mcd 45 ° 1 mA 1.6 V

HLMP-D150/D155, HLMP-K150/K155

Features

• Minimum luminous intensity specified at 1 mA

• High light output at low currents

• Wide viewing angle

• Outstanding material efficiency

• Low power/low forward voltage

• CMOS/MOS compatible

• TTL compatible

• Deep red color

Applications

• Low power circuits

• Battery powered equipment

• Telecommunication indicators

Description

These solid state LED lamps utilize newly developed

double heterojunction (DH) AlGaAs/GaAs material

technology. This LED material has outstanding light

output efficiency at very low drive currents. The color

is deep red at the dominant wavelength of 637

nanometres. These lamps are ideally suited for use in

applications where high light output is required with

minimum power output.

Package Dimensions

1.14 (0.045)

0.51 (0.020)

3.43 (0.135)

2.92 (0.115)

24.1

(0.95)

MIN.

4.70 (0.185)

4.19 (0.165)

3.17 (0.125)

2.67 (0.105)

2.79 (0.110)

2.29 (0.090)

1.52 (0.060)

1.02 (0.040)

6.35 (0.250)

5.58 (0.220)

0.55 (0.022)

0.40 (0.016)

CATHODE

∅

0.65 (0.026) MAX.

SQ. TYP.

SHOULDER

HLMP-D150

T-1

/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction

AlGaAs Red LED Lamps

Data Sheet

Summary of content (8 pages)

PAGE 1
HLMP-D150 T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Data Sheet HLMP-D150/D155, HLMP-K150/K155 Description These solid state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output efficiency at very low drive currents. The color is deep red at the dominant wavelength of 637 nanometres.
PAGE 2
Selection Guide Package Description T-1 3/4 Red Tinted Diffused T-1 3/4 Red Untinted Non-diffused T-1 Red Tinted Diffused T-1 Red Untinted Non-diffused Device HLMPD150 D150-C00xx D150-CD0xx D155 D155-F00xx K150 K150-C00xx K150-CD0xx K155 K155-CD0xx K155-D00xx K155-DE0xx Luminous Intensity Iv (mcd) at 1 mA Min. Typ. 1.3 3.0 1.3 3.0 1.3 3.0 5.4 10.0 5.4 10.0 1.3 2.0 1.3 2.0 1.3 3.0 2.1 3.0 1.3 3.0 2.1 3.0 2.1 3.0 Max. – – 4.2 – – – – 4.2 – 4.2 – 6.8 Note: 1.
PAGE 3
Absolute Maximum Ratings at TA = 25°C Parameter Peak Forward Current[1] Average Forward Current DC Current[2] Power Dissipation Reverse Voltage (IR = 100 µA) Transient Forward Current (10 µs Pulse)[3] LED Junction Temperature Operating Temperature Range Storage Temperature Range Value 300 mA 20 mA 30 mA 87 mW 5V 500 mA 110°C -20 to +100°C -55 to +100°C Notes: 1. Maximum IPEAK at f = 1 kHz, DF = 6.7%. 2. Derate linearly as shown in Figure 4. 3.
PAGE 4
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Maximum forward dc current vs. ambient temperature. Derating based on TJ Max. = 110 °C. Figure 5. Relative luminous intensity vs. angular displacement. HLMP-D150. Figure 6. Relative luminous intensity vs. angular displacement. HLMP-K150.
PAGE 5
Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D155. Intensity Bin Limits Color Red 5 Bin C D E F G H I J K L M N O P Q R S T U V W X Y Z Intensity Range (mcd) Min. Max. 1.5 2.4 2.4 3.8 3.8 6.1 6.1 9.7 9.7 15.5 15.5 24.8 24.8 39.6 39.6 63.4 63.4 101.5 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0 Figure 8.
PAGE 6
Mechanical Option Matrix Mechanical Option Code 00 01 02 A1 A2 B1 B2 DD DH Definition Bulk Packaging, minimum increment 500 pcs/bag Tape & Reel, crimped leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1 Tape & Reel, straight leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
PAGE 7
Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.
PAGE 8
For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved.