Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesLED wired Red Circular 3 mm 2 mcd 60 ° 1 mA 1.6 V

HLMP-D150, HLMP-D155, HLMP-K150 and HLMP-K155

T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction

AlGaAs Red LED Lamps

Data Sheet

Features

x Minimum luminous intensity speciﬁed at 1 mA

x High light output at low currents

x Wide viewing angle

x Outstanding material eﬃciency

x Low power/low forward voltage

x CMOS/MOS compatible

x TTL compatible

x Deep red color

Applications

x Low power circuits

x Battery powered equipment

x Telecommunication indicators

Description

These solid state LED lamps utilize double heterojunction

(DH) AlGaAs/GaAs material technology. This LED material

has outstanding light output eﬃciency at very low drive

currents. The color is deep red at the dominant wave-

length of 637 nanometres. These lamps are ideally suited

for use in applications where high light output is required

with minimum power output.

1.14 (0.045)

0.51 (0.020)

3.43 (0.135)

2.92 (0.115)

24.1

(0.95)

MIN.

4.70 (0.185)

4.19 (0.165)

3.17 (0.125)

2.67 (0.105)

2.79 (0.110)

2.29 (0.090)

1.52 (0.060)

1.02 (0.040)

6.35 (0.250)

5.58 (0.220)

0.55 (0.022)

0.40 (0.016)

CATHODE

∅

0.65 (0.026) MAX.

SQ. TYP.

SHOULDER

Package Dimensions

Notes:

1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES)

2 AN EPOXY MENISCUS MAY EXTEND ABOUT 1mm MAX. DOWN THE LEADS

Summary of content (9 pages)

PAGE 1
HLMP-D150, HLMP-D155, HLMP-K150 and HLMP-K155 T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Description Features These solid state LED lamps utilize double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output eﬃciency at very low drive currents. The color is deep red at the dominant wavelength of 637 nanometres.
PAGE 2
Selection Guide Luminous Intensity Iv (mcd) at 1 mA Package Description Device HLMP- Min. Typ. Max. 2θ1/2[1] Degree T-1 3/4 Red Tinted Diﬀused D150 1.3 3.0 – 65 A D150-C00xx 1.3 3.0 – 65 A D150-CD0xx 1.3 3.0 4.2 65 A T-1 3/4 Red Untinted Non-diﬀused D155 5.4 10.0 – 24 B D155-F00xx 5.4 10.0 – 24 B T-1 Red Tinted Diﬀused K150 1.3 2.0 – 60 C K150-C00xx 1.3 2.0 – 60 C K150-CD0xx 1.3 3.0 4.2 60 C K155 2.1 3.0 – 45 C K155-CD0xx 1.3 3.0 4.
PAGE 3
Absolute Maximum Ratings at TA = 25°C Parameter Value Peak Forward Current[1] 300 mA Average Forward Current 20 mA DC Current[2] 30 mA Power Dissipation 87 mW Reverse Voltage (IR = 100 μA) 5V Transient Forward Current (10 μs Pulse)[3] 500 mA LED Junction Temperature 110°C Operating Temperature Range -20 to +100°C Storage Temperature Range -40 to +100°C Notes: 1. Maximum IPEAK at f = 1 kHz, DF = 6.7%. 2. Derate linearly as shown in Figure 4. 3.
PAGE 4
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Maximum forward dc current vs. ambient temperature. Derating based on TJ Max. = 110 °C. Figure 5. Relative luminous intensity vs. angular displacement. HLMP-D150. Figure 6. Relative luminous intensity vs. angular displacement. HLMP-K150.
PAGE 5
Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D155. Intensity Bin Limits Intensity Range (mcd) Color Bin Min. Max. Red C 1.5 2.4 D 2.4 3.8 E 3.8 6.1 F 6.1 9.7 G 9.7 15.5 H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.
PAGE 6
Mechanical Option Matrix Mechanical Option Code Deﬁnition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1 02 Tape & Reel, straight leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1 A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag A2 T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag B1 T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/b
PAGE 7
Precautions: Lead Forming: x The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. x If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package.
PAGE 8
Example of Wave Soldering Temperature Proﬁle for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin ﬂux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be suﬃciently cooled to room temperature before exerting mechanical force.
PAGE 9
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