Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesLED wired Red Circular 3 mm 65 mcd 45 ° 20 mA 1.8 V

Description

These solid state LED lamps utilize newly developed

double heterojunction (DH) AlGaAs/GaAs material

technology. This LED material has outstanding light

output efficiency over a wide range of drive currents.

The color is deep red at the dominant wavelength of

637 nanometres. These lamps may be DC or pulse

driven to achieve desired light output.

Features

• Exceptional brightness

• Wide viewing angle

• Outstanding material efficiency

• Low forward voltage

• CMOS/MOS compatible

• TTL compatible

• Deep red color

Applications

• Bright ambient lighting conditions

• Moving message panels

• Portable equipment

• General use

HLMP-D101/D105, HLMP-K101/K105

T-1

(5 mm), T-1 (3 mm),

High Intensity, Double Heterojunction

AlGaAs Red LED Lamps

Data Sheet

Package Dimensions

ABC

1.14 (0.045)

0.51 (0.020)

3.43 (0.135)

2.92 (0.115)

24.1

(0.95)

MIN.

4.70 (0.185)

4.19 (0.165)

3.17 (0.125)

2.67 (0.105)

2.79 (0.110)

2.29 (0.090)

1.52 (0.060)

1.02 (0.040)

6.35 (0.250)

5.58 (0.220)

0.55 (0.022)

0.40 (0.016)

CATHODE

∅

0.65 (0.026) MAX.

SQ. TYP.

SHOULDER

Summary of content (8 pages)

PAGE 1
HLMP-D101/D105, HLMP-K101/K105 T-13/4 (5 mm), T-1 (3 mm), High Intensity, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Description Features These solid state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output efficiency over a wide range of drive currents. The color is deep red at the dominant wavelength of 637 nanometres. These lamps may be DC or pulse driven to achieve desired light output.
PAGE 2
Selection Guide Package Description T-1 3/4 Red Tinted Diffused T-1 3/4 Red Untinted Non-diffused T-1 Red Tinted Diffused T-1 Red Untinted Non-diffused Device HLMPD101 D101-J00xx D101-JK0xx D105 D105-M00xx D105-NO0xx K101 K101-I00xx K105 K105-J00xx Luminous Intensity Iv (mcd) at 20 mA Min. Typ. 35.2 70.0 35.2 70.0 35.2 70.0 138.0 240.0 138.0 240.0 200.0 290.0 22.0 45.0 22.0 45.0 35.2 65.0 35.2 65.0 Max. – – 112.8 – – 580.0 – – – – Note: 1.
PAGE 3
Absolute Maximum Ratings at TA = 25°C Parameter Peak Forward Current[1,2] Average Forward Current[2] DC Current[3] Power Dissipation Reverse Voltage (IR = 100 µA) Transient Forward Current (10 µs Pulse)[4] LED Junction Temperature Operating Temperature Range Storage Temperature Range Value 300 mA 20 mA 30 mA 87 mW 5V 500 mA 110°C -20 to +100°C -55 to +100°C Notes: 1. Maximum IPEAK at f = 1 kHz, DF = 6.7%. 2. Refer to Figure 6 to establish pulsed operating conditions. 3.
PAGE 4
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Relative efficiency vs. peak forward current. Figure 5. Maximum forward dc current vs. ambient temperature. Derating based on TJ MAX. = 110°C. Figure 6. Maximum tolerable peak current vs. peak duration (IPEAK MAX. determined from temperature derated IDC MAX.).
PAGE 5
Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101. Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101. Figure 9. Relative luminous intensity vs. angular displacement. HLMP-D105. Figure 10. Relative luminous intensity vs. angular displacement. HLMP-K105.
PAGE 6
Intensity Bin Limits Color Red Bin I J K L M N O P Q R S T U V W X Y Z Intensity Range (mcd) Min. Max. 24.8 39.6 39.6 63.4 63.4 101.5 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0 Maximum tolerance for each bin limit is ± 18%.
PAGE 7
Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.
PAGE 8
For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.