Datasheet

2
Package Dimension
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
4. RECOMMENDED PC BOARD HOLE DIAMETERS:
- LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).
- LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS
= 0.965/0.889 (0.038/0.035).
5. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
BA
1.14 ± 0.20
(0.045 ± � 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ±� 0.008)
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
1.00
(0.039)
MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
1.00
(0.039)
MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
d
1.50 ± 0.15
(0.059 ± 0.006)
PART NO. d
HLMP-XX13 12.42 ± 0.25
(0.489 ± 0.010)
HLMP-XX23 11.59 ± 0.25
(0.446 ± 0.010)
HLMP-XX37 11.96 ± 0.25
(0.471 ± 0.010)
6. FOR IDENTIFICATION OF POLARITY AFTER THE LEADS ARE TRIMMED OFF, PLEASE REFER TO THE ILLUSTRATION BELOW:
7. MAJOR HEAT PATH IS THROUGH THE ANODE LEAD
CATHODE
ANODE