Datasheet

13
Ammo Pack Drawing
Figure 10. Recommended wave soldering prole
Example of Wave Soldering Temperature Prole for TH LED
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
18.00 ± 0.50
(0.7087 ± 0.0197)
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
12.70 ± 0.30
(0.50 ± 0.0118)
CATHODE
0.70 ± 0.20
(0.0276 ± 0.0079)
20.50 ± 1.00
(0.807 ± 0.039)
A A
VIEW A–A
∅
4.00 ± 0.20
(0.1575 ± 0.008)
TYP.
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
0 100
250
200
150
100
50
TIME (SECONDS)
PREHEAT
TURBULENT WAVE
LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin ux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be suciently
cooled to room temperature before
exerting mechanical force.
TEMPERATURE (°C)
10
20
30
40
50
60
70
80
90