Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesLED wired Red Circular 5 mm 70 mcd 65 ° 30 mA 1.8 V

HLMP-D101/D105, HLMP-K101/K105

T-1

(5 mm), T-1 (3 mm),

High Intensity, Double Heterojunction

AlGaAs Red LED Lamps

Data Sheet

Description

These solid-state LED lamps utilize newly developed

double heterojunction (DH) AlGaAs/GaAs material tech-

nology. This LED material has outstanding light output

eciency over a wide range of drive currents. The color is

deep red at the dominant wavelength of 637 nanometers.

These lamps may be DC or pulse driven to achieve desired

light output.

Features

• Exceptional brightness

• Wide viewing angle

• Outstanding material eciency

• Low forward voltage

• CMOS/MOS compatible

• TTL compatible

• Deep red color

Applications

• Bright ambient lighting conditions

• Moving message panels

• Portable equipment

• General use

Package Dimensions

0.65 (0.026) max.

24.1(.95) MIN.

4.70 (.185)

4.19 (.165)

3.43 (.135)

2.92 (.115)

1.52 (.060)

1.02 (.040)

2.79 (.110)

2.29 (.090)

1.14 (.045)

0.51 (.020)

(0.022) 0.55

SQ. TYP.

(0.016) 0.40

3.17 (.125)

2.67 (.105)

6.35 (.250)

5.58 (.220)

25.40(1.00)

MINIMUM

2.54 (0.100) NOM.

0.55 (0.022)

0.40 (0.016)

6.10 (0.240)

5.59 (0.220)

1.27(0.050)

NOM.

0.89 (0.035)

0.64 (0.025)

5.08 (0.200)

4.57 (0.180)

9.19 (0.362)

8.43 (0.332)

SQUARE TYP.

CATHODE LEAD

0.65 (0.026) max

Notes:

1. All dimensions are in mm (inches).

2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.

3. For PCB hole recommendations, see the Precautions section.

6.1 (0.240)

5.6 (0.220)

23.0

(0.90)

MIN.

0.46 (0.018)

SQUARE NOMINAL

2.54 (0.100)

NOM.

CATHODE

1.27 (0.050)

NOM.

0.89 (0.035)

0.64 (0.025)

9.19 (0.362)

8.43 (0.332)

12.44 (0.490)

11.68 (0.460)

1.32 (0.052)

1.02 (0.040)

5.08 (0.200)

4.57 (0.180)

Summary of content (8 pages)

PAGE 1
HLMP-D101/D105, HLMP-K101/K105 T-13/4 (5 mm), T-1 (3 mm), High Intensity, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Description Features These solid-state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output efficiency over a wide range of drive currents. The color is deep red at the dominant wavelength of 637 nanometers. These lamps may be DC or pulse driven to achieve desired light output.
PAGE 2
Selection Guide Luminous Intensity Iv (mcd) at 20 mA Package Description Device HLMP- Min. Typ. Max. 2θ1/2[1] Degree Package Outline T-1 3/4 Red Tinted Diffused D101 35.2 70.0 – 65 A D101-J00xx 35.2 70.0 – 65 A D101-JK0xx 35.2 70.0 112.8 65 A D105 138.0 240.0 – 24 B D105-M00xx 138.0 240.0 – 24 B D105-NO0xx 200.0 290.0 580.0 24 B K101 22.0 45.0 – 60 C K101-I00xx 22.0 45.0 – 60 C K105 35.2 65.0 – 45 C K105-J00xx 35.2 65.
PAGE 3
Absolute Maximum Ratings at TA = 25°C Parameter Value Peak Forward Current[1,2] 300 mA Average Forward Current[2] 20 mA DC Current[3] 30 mA Power Dissipation 87 mW Reverse Voltage (IR = 100 μA) 5V Transient Forward Current (10 μs Pulse)[4] 500 mA LED Junction Temperature 110°C Operating Temperature Range -20 to +100°C Storage Temperature Range -40 to +100°C Notes: 1. Maximum IPEAK at f = 1 kHz, DF = 6.7%. 2. Refer to Figure 6 to establish pulsed operating conditions. 3.
PAGE 4
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Relative efficiency vs. peak forward current. Figure 5. Maximum forward dc current vs. ambient temperature. Derating based on TJ MAX. = 110°C. Figure 6. Maximum tolerable peak current vs. peak duration (IPEAK MAX. determined from temperature derated IDC MAX.).
PAGE 5
Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101. Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101. Figure 9. Relative luminous intensity vs. angular displacement. HLMP-D105. Figure 10. Relative luminous intensity vs. angular displacement. HLMP-K105.
PAGE 6
Intensity Bin Limits Intensity Range (mcd) Color Bin Min. Max. Red I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Maximum tolerance for each bin limit is ± 18%.
PAGE 7
Precautions Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package.
PAGE 8
Example of Wave Soldering Temperature Profile for TH LED 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE Flux: Rosin flux Solder bath temperature: 245 °C ± 5 °C (maximum peak temperature = 250 °C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3 sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force.