Datasheet

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HLMP-4100/4101

T-1

(5 mm) Double Heterojunction

AlGaAs Very High Intensity Red LED Lamps

Data Sheet

Features

• 1000 mcd at 20 mA

• Very high intensity at low drive currents

• Narrow viewing angle

• Outstanding material eciency

• Low forward voltage

• CMOS/MOS compatible

• TTL compatible

• Deep red color

Applications

• Bright ambient lighting conditions

• Emitter/detector and signaling applications

• General use

Description

These solid state LED lamps utilize newly developed double

heterojunction (DH) AlGaAs/GaAs material technology.

This LED material has outstanding light output eciency

over a wide range of drive currents. The lamp package

has a tapered lens designed to concentrate the luminous

ux into a narrow radiation pattern to achieve a very high

intensity. The LED color is deep red at the dominant wave-

length of 637 nanometers. These lamps may be DC or

pulse driven to achieve desired light output.

Package Dimensions

6.10 (0.240)

5.59 (0.220)

2.54 (0.100)

NOMINAL

CATHODE

23.0 (0.90) MIN.

12.44 (0.490)

11.68 (0.460)

9.19 (0.362)

8.43 (0.332)

1.32 (0.052)

1.02 (0.040)

0.46 (0.018)

SQUARE

NOMINAL

0.89 (0.035)

0.64 (0.025)

1.27 (0.050) NOM.

5.08 (0.200)

4.57 (0.180)

Summary of content (6 pages)

PAGE 1
HLMP-4100/4101 T-13/4 (5 mm) Double Heterojunction AlGaAs Very High Intensity Red LED Lamps Data Sheet Description Features These solid state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output efficiency over a wide range of drive currents. The lamp package has a tapered lens designed to concentrate the luminous flux into a narrow radiation pattern to achieve a very high intensity.
PAGE 2
Selection Guide Luminous Intensity Iv (mcd) at 20 mA Device HLMP- Min. Typ. Max. 2θ1/2 [1] Degree 4100 500.0 750.0 – 8 4101 700.0 1000.0 – 8 4101-ST0xx 1400.0 2700.0 4000.0 8 Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Part Numbering System HLMX - 4 1 XX - X X X XX Mechanical Option 00: Bulk Color Bin Options 0: Full color bin distribution Maximum Iv Bin Options 0: Open (No. max.
PAGE 3
Absolute Maximum Ratings at TA = 25°C Parameter Maximum Rating Units Peak Forward Current[1, 2] 300 mA Average Forward Current[2] 20 mA DC Current[3] 30 mA Power Dissipation 87 mW Reverse Voltage (IR = 100 μA) 5 V Transient Forward Current (10 μs Pulse)[4] 500 mA Operating Temperature Range -20 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Maximum IPEAK at f = 1 kHz, DF = 6.7%. 2. Refer to Figure 6 to establish pulsed operating conditions. 3.
PAGE 4
IF – FORWARD CURRENT – mA RELATIVE INTENSITY 1.0 0.5 0 0 600 650 700 300 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 0.5 WAVELENGTH – nm 1.0 1.5 2.0 2.5 3.5 3.0 VF – FORWARD VOLTAGE – V Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. ηV – RELATIVE EFFICIENCY (NORMALIZED AT 20 mA) 1.2 1.4 NORMALIZED LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 1.0 0.8 0.6 0.4 0.
PAGE 5
10 20 0 40 0.14 0.135 0.12 50 60 0.10 0.08 70 0.06 0.04 80 0.02 90 0 NORMALIZED INTENSITY 10 20 30 40 50 60 70 80 0 90 100 ϕN (θ) LUMINOUS FLUX TO INTENSITY RATIO WITHIN A GIVEN CONE ANGLE IV (0) 30 θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE) Figure 7. Relative luminous intensity vs. angular displacement. Intensity Bin Limits Color Red Bin Intensity Range (mcd) Min. Max. P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.
PAGE 6
Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.