Datasheet

4
Maximum Solder Reow Thermal Prole
Recommended Pb-Free IR Prole
0
TIME (SECONDS)
TEMPERATURE (˚C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160˚C
140˚C
150˚C
PEAK
TEMP.
245˚C
PEAK
TEMP.
240˚C
PEAK
TEMP.
230˚C
SOLDERING
TIME
200˚C
PREHEATING TIME
150˚C, 90 + 30 SEC.
2.5˚C ± 0.5˚C/SEC.
3˚C + 1˚C/–0.5˚C
TIGHT
TYPICAL
LOOSE
ROOM TEMPERATURE
PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
217 ˚C
RAMP-DOWN
6 ˚C/SEC. MAX.
RAMP-UP
3 ˚C/SEC. MAX.
150 - 200 ˚C
260 +0/-5 ˚C
t 25 ˚C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 ˚C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME (SECONDS)
TEMPERATURE (˚C)
NOTES:
THE TIME FROM 25 ˚C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 ˚C, T
smin
= 150 ˚C
Note: Use of non-chlorine-activated uxes is highly recommended.
Note: Use of non-chlorine-activated uxes is highly recommended.