Datasheet

5
Solder Reow Temperature Prole Regulatory Information
The HCPL-7723/0723 have been
approved by the following organi-
zations:
UL
Recognized under UL1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997+A1:2002/
EN 60747-5-2:2001+A1:2002/
DIN EN 60747-5-2 (VDE 0884
Teil 2): 2003-01.
(Option 060 only)
Insulation and Safety Related Specications
Value
Parameter Symbol 7723 0723 Units Conditions
Minimum External Air Gap L(I01) 7.1 4.9 mm Measured from input terminals to output
(Clearance) terminals, shortest distance through air.
Minimum External Tracking L(I02) 7.4 4.8 mm Measured from input terminals to output
(Creepage) terminals, shortest distance path along body.
Minimum Internal Plastic Gap 0.08 0.08 mm Insulation thickness between emitter and
(Internal Clearance) detector; also known as distance through
insulation.
Tracking Resistance CTI ≥ 175 ≥ 175 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
Recommended Pb-Free IR Prole
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide ux should be used.
Note: Non-halide ux should be used.