Datasheet

6
Insulation and Safety Related Specifications
8-Pin DIP
(300 mil) SO-8
Parameter Symbol Value Value Units Conditions
Min.. External Air Gap L(IO1) 7.1 4.9 mm Measured from input terminals to output
(External Clearance) sterminals, hortest distance through air
Min.. External Tracking L(IO2) 7.4 4.8 mm Measured from input terminals to output
Path (External Creepage) terminals, shortest distance path along body
Min.. Internal Plastic 0.08 0.08 mm Through insulation distance, conductor to
Gap (Internal Clearance) conductor, usually the direct distance between
the photoemitter and photodetector inside the
optocoupler cavity
Tracking Resistance CTI 200 200 V DIN IEC 112/VDE 0303 PART 1
(Comparative
Tracking Index)
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Recommended Operating Conditions
Parameter Symbol Min. Max. Units Note
Supply Voltage V
CC
218 V
Operating Temperature T
A
070°C
Operating Frequency f 0 4 kHz 8
Absolute Maximum Ratings (No derating required up to 70°C)
Parameter Symbol Min. Max. Units Note
Storage Temperature T
S
-55 125 °C
Operating Temperature T
A
-40 85 °C
Lead Soldering Cycle Temperature 260 °C1
Time 10 s
Input Current Average 50 2
Surge I
IN
140 mA 2, 3
Transient 500
Input Voltage (Pins 2-3) V
IN
-0.5 V
Input Power Dissipation HCPL-3700/3760 P
IN
230 mW 4
HCPL-0370 172
Total Package Power Dissipation HCPL-3700/3760 P
T
305 mW 5
HCPL-0370 275
Output Power Dissipation HCPL-3700/3760 P
O
210 mW 6
HCPL-0370 103
Output Current Average I
O
30 mA 7
Supply Voltage (Pins 8-5) V
CC
-0.5 20 V
Output Voltage (Pins 6-5) V
O
-0.5 20 V
Solder Reflow Temperature Profile See Package Outline Drawings section