Datasheet

3
Package Outline Drawing
Solder Reow Temperature Prole
1) One-time soldering reow is rec-
ommended within the condition
of temperature and time prole
shown at right.
2) When using another soldering
method such as infrared ray lamp,
the temperature may rise partially
in the mold of the device. Keep the
temperature on the package of the
device within the condition of (1)
above.
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25°C
150°C
200°C
250°C
260°C (Peak Temperature)
217°C
Time (sec)
Temperature (
°
C)
HCPL-354-000E
HCPL-354-060E
DIMENSIONS IN MILLIMETERS.
4.40 ± 0.2
3.60 ± 0.3
2.00 ± 0.2
5.30 ± 0.3
7.00
0.40 ± 0.1
0.10 ± 0.1
354
Y W W
2.54
± 0.25
DATE CODE
RANK
LEAD
FREE
+ 0.2
– 0.7
DIMENSIONS IN MILLIMETERS.
4.40 ± 0.2
3.60 ± 0.3
2.00 ± 0.2
5.30 ± 0.3
7.00
0.40 ± 0.1
0.10 ± 0.1
354 V
Y W W
2.54
± 0.25
DATE CODE
RANK
LEAD
FREE
+ 0.2
– 0.7
Note: Non-halide ux should be used.