Datasheet

5
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
T
S
– CASE TEMPERATURE – °C
200
600
400
25
800
50 75 100
200
150 175
P
S
(mW)
125
100
300
500
700
I
S
(mA)
Insulation and Safety Related Specifications
Parameter Symbol HCPL-3140 HCPL-0314 Units Conditions
Minimum External Air Gap L(101) 7.1 4.9 mm Measured from input terminals
(Clearance) to output terminals, shortest
distance through air.
Minimum External Tracking L(102) 7.4 4.8 mm Measured from input terminals
(Creepage) to output terminals, shortest
distance path along body.
Minimum Internal Plastic Gap 0.08 0.08 mm Through insulation distance
(Internal Clearance) conductor to conductor, usually
the straight line distance
thickness between the emitter
and detector.
Tracking Resistance CTI >175 >175 V DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group IIIa IIIa Material Group (DIN VDE
0110, 1/89, Table 1)
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Note
Storage Temperature T
S
-55 125 °C
Operating Temperature T
A
-40 100 °C
Average Input Current I
F(AVG)
25 mA 1
Peak Transient Input Current (<1 µs pulse I
F(TRAN)
1.0 A
width, 300pps)
Reverse Input Voltage V
R
5V
“High” Peak Output Current I
OH(PEAK)
0.6 A 2
“Low” Peak Output Current I
OL(PEAK)
0.6 A 2
Supply Voltage V
CC
-V
EE
-0.5 35 V
Output Voltage V
O(PEAK)
-0.5 V
CC
V
Output Power Dissipation P
O
250 mW 3
Input Power Dissipation P
I
45 mW 4
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile See Package Outline Drawings section