Datasheet

5
Solder Reow Temperature Prole
0
TIME (SECONDS)
TEMPERATURE ( C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160 C
140 C
150 C
PEAK
TEMP.
245°C
PEAK
TEMP.
240
°
C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150 C, 90 + 30 SEC.
2.5 C ± 0.5 C/SEC.
3 C + 1 C/–0.5 C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
Recommended PB-Free IR Prole
217 C
RAMP-DOWN
6 C/SEC. MAX.
RAMP-UP
3 C/SEC. MAX.
150 - 200 C
260 +0/-5 C
t 25 C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 C, T
smin
= 150 C
Note: Non-halide ux should be used.
Note: Non-halide ux should be used.