Datasheet

3
Package Outline Drawings
HCPL-181-000E
HCPL-181-060E
Solder Reow Temperature Prole
1. One-time soldering reow is recommended within the
condition of temperature and time prole shown at
right.
2. When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package of
the device within the condition of (1) above.
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25°C
150°C
200°C
250°C
260°C (Peak Temperature)
217°C
Time (sec)
Temperature (
°
C)
DIMENSIONS IN MILLIMETERS.
4.40 ± 0.2
3.60 ± 0.3
2.00 ± 0.2
5.30 ± 0.3
0.2 ± 0.05
7.00
0.40 ± 0.1
0.10 ± 0.1
181
Y W W
2.54
± 0.25
DATE CODE
RANK
LEAD
FREE
+ 0.2
– 0.7
DIMENSIONS IN MILLIMETERS.
4.40 ± 0.2
3.60 ± 0.3
2.00 ± 0.2
5.30 ± 0.3
0.2 ± 0.05
7.00
0.40 ± 0.1
0.10 ± 0.1
181 V
Y W W
2.54
± 0.25
DATE CODE
RANK
LEAD
FREE
+ 0.2
– 0.7
Note: Non-halide ux should be used.