Datasheet

7
Absolute Maximum Ratings (No Derating Required up to +85˚C)
Parameter Symbol Min. Max. Units
Storage Temperature T
S
–55 125 ˚C
Operating Temperature T
A
–40 85 ˚C
Average Forward Input Current I
F(AVG)
20 mA
Peak Forward Input Current I
F(PEAK)
40 mA
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current I
F(TRAN)
1.0 A
(< 1 µs Pulse Width, 300 pps)
Reverse Input Voltage V
R
5 V
Input Power Dissipation P
I
35 mW
Output Current (Pin 6) I
O
60 mA
Emitter Base Reverse Voltage (Pin 5-7) V
EB
0.5 V
Supply Voltage and Output Voltage V
CC
–0.5 7 V
Output Power Dissipation P
O
100 mW
Total Power Dissipation P
T
135 mW
Lead Solder Temperature 260˚C for 10 sec., 1.6 mm below seating plane.
(for Through Hole Devices)
Reow Temperature Prole See Package Outline Drawings section.
(for SOIC-8 and Option #300)
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage V
CC
2.7 7.0 V
Forward Input Current (ON) I
F(ON)
0.5 12.0 mA
Forward Input Voltage (OFF) V
F(OFF)
0 0.8 V
Operating Temperature T
A
0 70 ˚C