Datasheet

5
Solder Reow Temperature Prole
Recommended Pb-Free IR Prole
Note: Non-halide ux should be used.
Note: Non-halide ux should be used.
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL Approval under UL 1577, Component Recognition Program, File E55361.
CSA Approval under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (Option 060 only)
217 °C
RAMP-DOWN
6°C/SEC.MAX.
RAMP-UP
3°C/SEC.MAX.
150 - 200°C
260 +0/-5°C
t25°C toPEAK
60to150SEC.
20-40SEC.
TIMEWITHIN5°CofACTUAL
PEAKTEMPERATURE
t
p
t
s
PREHEAT
60to180SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/-0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/-0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.