Datasheet

6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW4502/3)
Solder Reflow Temperature Profile
1.00 ± 0.15
(0.039 ± 0.006)
7° NOM.
12.30 ± 0.30
(0.484 ± 0.012)
0.75 ± 0.25
(0.030 ± 0.010)
11.00
(0.433)
5
6
7
8
4321
11.15 ± 0.15
(0.442 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1.3
(0.051)
13.56
(0.534)
2.29
(0.09)
LAND PATTERN RECOMMENDATION
1.78 ± 0.15
(0.070 ± 0.006)
4.00
(0.158)
MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
Dimensions in millimeters (inches).
Lead coplanarity = 0.10 mm (0.004 inches).
Note: Floating lead protrusion is 0.25 mm (10 mils) max.
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
MAX.
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5 C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
Note: Non-halide flux should be used.
PREHEATING RATE
3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE
2.5°C ± 0.5°C/SEC.