Datasheet

8
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics
HCPL-3120
Description Symbol Option 060 HCPL-J312 HCNW3120 Unit
Installation classication per DIN VDE 0110/1.89,
Table 1
for rated mains voltage ≤150 V rms I-IV I-IV I-IV
for rated mains voltage ≤300 V rms I-IV I-IV I-IV
for rated mains voltage ≤450 V rms I-III I-III I-IV
for rated mains voltage ≤600 V rms I-III I-IV
for rated mains voltage ≤1000 V rms I-III
Climatic Classication 55/100/21 55/100/21 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2 2 2
Maximum Working Insulation Voltage V
IORM
630 891 1414 V
peak
Input to Output Test Voltage, Method b* V
PR
1181 1670 2652 V
peak
V
IORM
x 1.875 = V
PR
, 100% Production Test,
t
m
= 1 sec, Partial Discharge < 5pC
Input to Output Test Voltage, Method a* V
PR
945 1336 2121 V
peak
V
IORM
x 1.5 = V
PR
, Type and Sample Test,
t
m
= 60 sec, Partial Discharge < 5pC
Highest Allowable Overvoltage* V
IOTM
6000 6000 8000 V
peak
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values – maximum values allowed
in the event of a failure, also see Figure 37.
Case Temperature T
S
175 175 150 °C
Input Current I
S INPUT
230 400 400 mA
Output Power P
S OUTPUT
600 600 700 mW
Insulation Resistance at T
S
, V
IO
= 500 V R
S
≥10
9
≥10
9
≥10
9
Ω
*Refer to the IEC/EN/DIN EN 60747-5-2 section (page 1-6/8) of the Isolation Control Component Designer’s Catalog for a detailed description of
Method a/b partial discharge test proles.
Note: These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data shall be en-
sured by means of protective circuits. Surface mount classication is Class A in accordance with CECC 00802.
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the
equipment designer when determining the circuit insula-
tion requirements. However, once mounted on a printed
circuit board, minimum creep-age and clearance require-
ments must be met as specied for individual equipment
standards. For creepage, the shortest distance path along
the surface of a printed circuit board between the solder
llets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board
to achieve desired creepage and clearances. Creepage
and clearance distances will also change depending on
factors such as pollution degree and insulation level.