Datasheet

5
Solder Reow Temperature Prole
Regulatory Information
The HCNR200/201 optocoupler features a 0.400” wide, eight pin DIP package. This package was specically designed
to meet worldwide regulatory requirements. The HCNR200/201 has been approved by the following organizations:
Recommended Pb-Free IR Prole
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160 °C
140 °C
150 °C
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °C
PEAK
TEMP.
230 °C
SOLDERING
TIME
200 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
2.5 C ± 0.5 °C/SEC.
3 °C + 1 °C/–0.5 °C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
NOTE: NON-HALIDE FLUX SHOULD BE USED.
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
* 260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
15 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE
FOR WIDEBODY 400mils PACKAGE IS 245 °C
UL
Recognized under UL 1577, Component Recognition
Program, FILE E55361
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747‑5‑2:1997 + A1:2002
EN 60747‑5‑2:2001 + A1:2002
DIN EN 60747‑5‑2 (VDE 0884 Teil 2):2003‑01
(Option 050 only)