Datasheet

13
Figure 25. Adding Vias to the ATF-54143 Non-Linear Model for Comparison to Measured S and Noise Parameters.
DRAIN
VIA2
V1
D=20.0 mil
H=25.0 mil
T=0.15 mil
Rho=1.0
W=40.0 mil
VIA2
V2
D=20.0 mil
H=25.0 mil
T=0.15 mil
Rho=1.0
W=40.0 mil
VIA2
V4
D=20.0 mil
H=25.0 mil
T=0.15 mil
Rho=1.0
W=40.0 mil
SOURCE
GATESOURCE
ATF-54143
MSUB
MSub1
H=25.0 mil
Er=9.6
Mur=1
Cond=1.0E+50
Hu=3.9e+034 mil
T=0.15 mil
TanD=0
Rough=0 mil
MSub
VIA2
V3
D=20.0 mil
H=25.0 mil
T=0.15 mil
Rho=1.0
W=40.0 mil
For Further Information
The information presented here is an introduction
to the use of the ATF-54143 enhancement mode
PHEMT. More detailed application circuit information
is available from Avago Technologies. Consult the web
page or your local Avago Technologies sales representa-
tive.
Designing with S and Noise Parameters and the Non-Linear
Model
The non-linear model describing the ATF-54143
includes both the die and associated package model.
The package model includes the e ect of the pins but
does not include the e ect of the additional source
inductance associated with grounding the source leads
through the printed circuit board. The device S and
Noise Parameters do include the e ect of 0.020 inch
thickness printed circuit board vias. When comparing
simulation results between the measured S parameters
and the simulated non-linear model, be sure to include
the e ect of the printed circuit board to get an accurate
comparison. This is shown schematically in Figure 25.