Datasheet

7
XX
Y
Y
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
Red Green Blue
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
Red BlueGreen
Figure 11a. Radiation pattern along x-axis of the package Figure 11b. Radiation pattern along y-axis of the package
Figure 11c. Illustration of package axis for radiation pattern
Figure 12. Recommended soldering land pattern
Figure 13. Carrier tape dimensions
Maximize the size of copper pad of PIN 1, PIN 4, PIN5
for better heat dissipation.
Copper pad Solder mask
0.40
0.50
2.30
1.35
1.60
4.55
Package Marking
8.00
+0.30
-0.10
∅ 1.00
+0.10
0
∅ 1.50
+0.10
0
2.00 ±0.054.00 ±0.10 4.00 ±0.10
3.05 ±0.10
1.75 ±0.10
2.29 ±0.10
0.229 ±0.01
3.81 ±0.10
3.50 ±0.05