Datasheet

7
Figure 12. Recommended soldering land pattern
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
0.0
0.2
0.4
0.6
0.8
1.0
NORMALIZED INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
NORMALIZED INTENSITY
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
Red
Green
Blue
Red
Green
Blue
XX
Y
Y
Figure 11c. Illustration of package axis for radiation pattern
Figures 11b. Radiation pattern along y-axis of the packageFigures 11a. Radiation pattern along x-axis of the package
Maximize the size of copper pad of PIN 1, PIN 4, PIN5
for better heat dissipation.
Copper pad Solder mask
0.40
0.50
2.30
1.35
1.60
4.55