Datasheet

11
PRECAUTIONARY NOTES
1. Handling precautions
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy en-
capsulant, whichis hard and brittle, silicone is softer and
exible. Special handling precautions must be taken
during assembly of silicone encapsulated LED products.
Failure to comply might lead to damage and premature
failure of the LED. For more information. refer to Applica-
tion Note AN5288, Silicone Encapsulation for LED: Advan-
tages and Handling Precautions.
a. Do not poke sharp objects into the silicone encapsulant.
Sharp objects such as tweezers or syringes might exert
excessive force or even pierce through the silicone and
induce failures in the LED die or wire bond.
b. Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only by
its body.
c. Do no stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
d. The surface of silicone materials attracts more dust
and dirt than to epoxy, due to its surface tackiness. To
remove foreign particles on the surface of silicone, a
cotton bud can be used with isopropyl alcohol (IPA).
During cleaning, rub the surface gently without putting
much pressure on the silicone. Ultrasonic cleaning is
not recommended.
e. For automated pick and place, Avago has tested that the
following nozzle size works ne with this LED. However,
due to possible variations in other parameters such
as pick and place machine maker/model and other
settings of the machine, it is recommended that you
verify that the nozzle selected will not cause damage
to the LED.
ID
OD
ID = 1.7mm
OD = 3.5mm
2. Handling of moisture-sensitive device
This product has a Moisture Sensitive Level 2a rating per
JEDEC J-STD-020. For additional details and a review of
proper handling procedures, refer to Avago Application
Note AN5305, Handling of Moisture Sensitive Surface Mount
Devices.
a. Before use
- An unopened moisture barrier bag (MBB) can be
stored at < 40 °C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the Humidity
Indicator Card (HIC) indicates that baking is not
required, then it is safe to reow the LEDs per the
original MSL rating.
- It is recommended that the MBB not be opened
before assembly (e.g., for IQC).
b. Control after opening the MBB
- The HIC shall be read immediately upon opening of
the MBB.
- The LEDs must be kept at < 30 °C/60% RH at all
times and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.
c. Control for unnished reel
- Unused LEDs must be stored in a sealed MBB with
desiccant or desiccator at < 5% RH.
d. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
must be stored in a sealed MBB with desiccant or
desiccator at < 5% RH to ensure that all LEDs have
not exceeded their oor life of 672 hours.
e. Baking is required if:
- The HIC indicator is not BROWN at 10% and is AZURE
at 5%.
- The LEDs are exposed to a condition of >30 °C / 60%
RH at any time.
- The LED oor life exceeded 672 hrs.
The recommended baking condition is: 60 ± 5 °C for 20
hrs. Baking should only be done once.
f. Storage
- The soldering terminals of these Avago LEDs are
silver plated. If the LEDs are exposed in an ambient
environment for too long, the silver plating
might be oxidized and thus aect its solderability
performance. As such, unused LEDs must be kept in
a sealed MBB with desiccant or in desiccator at < 5%
RH.