Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED PLCC6 Red, Green, Blue 450 mcd, 560 mcd, 180 mcd 120 ° 20 mA 2.1 V, 3.2 V

ASMT-YTC2-0AA02

High Brightness Tricolor PLCC6 Black Body LED

Data Sheet

Description

This family of SMT LEDs packaged in the form of PLCC-6

with separate heat path for each LED dice, enabling it to

be driven at higher current.

Individually addressable pin-outs give higher exibility in

circuitry design. With closely matched radiation pattern

along the package’s x-axis, these LEDs are suitable for

indoor full color display application.

For easy pick & place, the LEDs are shipped in tape and

reel. Every reel is shipped from a single intensity and

color bin for better uniformity. The full black body of the

LED provides extreme contrast enhancement for short

distance viewing of ne pitch full color display.

These LEDs are compatible with reow soldering process.

Applications

• Indoor full color display

Features

• Standard PLCC-6 package (Plastic Leaded Chip Carrier)

with individual addressable pin-out for higher exibility

of driving conguration

• High reliability LED package with silicone encapsulation

• High brightness using AlInGaP and InGaN dice

technologies

• Typical viewing angle 120 °

• Compatible with reow soldering process

• JEDEC MSL 2a

• Water-Resistance (IPX6*) per IEC 60529:2001

* The test is conducted on component level by mounting the

components on PCB with proper potting to protect the leads. It is

strongly recommended that customers perform necessary tests on

the components for their nal application.

CAUTION: LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during han-

dling and processing. Please refer to Avago Application Note AN-1142 for additional details.

Summary of content (12 pages)

PAGE 1
ASMT-YTC2-0AA02 High Brightness Tricolor PLCC6 Black Body LED Data Sheet Description Features This family of SMT LEDs packaged in the form of PLCC-6 with separate heat path for each LED dice, enabling it to be driven at higher current. • Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration Individually addressable pin-outs give higher flexibility in circuitry design.
PAGE 2
Package Dimensions 3 5 2 6 1 3.00 0.50 4 2.30 2.80 2.30 3.40 4 1.80 5 0.20 0.90 Lead Configuration 1 Cathode (Blue) 2 Cathode (Green) 3 Cathode (Red) 4 Anode (Red) 5 Anode (Green) 6 Anode (Blue) Notes: 1. All dimensions are in millimeter (mm). 2. Unless otherwise specified, tolerance is ± 0.20 mm. 3. Encapsulation = silicone 4.
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Table 1. Absolute Maximum Ratings (TJ = 25 °C) Parameter Red Green & Blue Unit 50 30 mA 100 100 mA 114 V DC forward current [1] Peak forward current [2] Power dissipation 125 Reverse voltage [3] 4 V 125 °C Operating temperature range -40 to + 110 °C Storage temperature range -40 to + 120 °C Junction temperature Notes: 1. Derate linearly as shown in Figure 7 to Figure 10. 2. Duty Factor = 10% Frequency = 1 kHz 3.
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Part Numbering System A S M T - Y T C 2 - 0 A x1 A 0 2 x2 x3 x4 x5 Code Description Option x1 x2 Package type Minimum intensity bin C A x3 x4 Number of intensity bins Color bin combination A 0 x5 Test option 2 Black Body Red: bin T2 Red: bin T2, U1, U2 Green: bin U1 Green: bin U1, U2, V1 Blue: bin R1 Blue: bin R2, S1, S2 3 intensity bins from minimum Red: full distribution Green: bin A, B, C Blue: bin A, B, C, D, E Test current = 20 mA Table 4.
PAGE 5
Characteristics 100 1.0 Green Blue Red FORWARD CURRENT-mA RELATIVE INTENSITY 0.8 0.6 0.4 0.2 0.0 380 480 580 WAVELENGTH - nm DOMINANT WAVELENGTH SHIFT - nm Red Blue Green 0 20 20 0 1 2 3 FORWARD VOLTAGE-V 4 5 Figure 5. Relative Luminous Intensity vs. Junction Temperature -2 -4 -6 Red Green Blue -8 120 20 100 0.3 1 0 20 40 60 80 100 TJ - JUNCTION TEMPERATURE - °C 0 40 60 80 FORWARD CURRENT - mA Figure 4. Dominant Wavelength Shift vs.
PAGE 6
0 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 60 50 TS 40 TA 30 20 10 0 0 20 40 60 80 TEMPERATURE - °C 100 20 10 0 20 40 60 80 TEMPERATURE - °C TS 30 TA 20 10 0 20 40 60 80 TEMPERATURE - °C 100 120 120 TS 30 TA 20 10 0 0 20 40 60 80 TEMPERATURE - °C 100 120 Figure 10. Maximum Forward Current vs. Temperature for Green & Blue (3 chips on) Figure 9. Maximum Forward Current vs.
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1 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1.0 0.6 0.4 Red Green Blue 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREE 60 0.6 0.4 0 -90 90 Red Green Blue 0.2 -60 -30 Figure 11b. Radiation pattern along y-axis of the package Y X Y Figure 11c. Illustration of package axis for radiation pattern 2.30 0.50 4.55 1.35 1.60 Maximize the size of copper pad of PIN 1, PIN 4, PIN5 for better heat dissipation. 0.40 Figure 12.
PAGE 8
4.00 ±0.10 4.00 ±0.10 2.00 ±0.05 +0.10 ∅ 1.50 0 Package Marking 1.75 ±0.10 3.50 ±0.05 2.29 ±0.10 +0.30 8.00 -0.10 +0.10 ∅ 1.00 0 3.05 ±0.10 3.81 ±0.10 0.229 ±0.01 Figure 13. Carrier tape dimensions USER FEED DIRECTION PACKAGE MARKING PRINTED LABEL Figure 14. Reeling Orientation 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) 13.1 ± 0.5 Ø (0.516 ± 0.020) 20.20 MIN. Ø (0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.
PAGE 9
Packing Label (i) Standard label (attached on moisture barrier bag) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant Halogen Free e4 Max Temp 260C MSL2a (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (9D) Date Code: Date Code (V) Vendor ID: DeptID: Made In: Country of Origin (ii) Baby label (attached on plastic reel) (1P) PART #: Part Number BABY LABEL COSB001B V0.
PAGE 10
Soldering Recommended reflow soldering condition: (i) Leaded reflow soldering: (ii) Lead-free reflow soldering: 20 SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME a. Reflow soldering must not be done more than 2 times. Make sure the necessary precautions are observed for handling moisture-sensitive device as stated in the following section. b. Recommended board reflow direction: TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX.
PAGE 11
PRECAUTIONARY NOTES 1. Handling precautions 2. Handling of moisture-sensitive device The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, whichis hard and brittle, silicone is softer and flexible. Special handling precautions must be taken during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. For more information.
PAGE 12
3. Application precautions a. Drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the datasheet. Constant current driving is recommended to ensure consistent performance. The complication of using this formula lies in TA and RqJ-A. Actual TA is sometimes subjective and hard to determine. RqJ-A varies from system to system depending on design and is usually not known. b. LED is not intended for reverse bias.