Datasheet

10
PRECAUTIONARY NOTES
1. Handling precautions
The encapsulation material of the LED is made of sili-
cone for better product reliability. Compared to epoxy
encapsulant that is hard and brittle, silicone is softer
and exible. Special handling precautions need to be
observed during assembly of silicone encapsulated
LED products. Failure to comply might lead to damage
and premature failure of the LED. Do refer to Applica-
tion Note AN5288, Silicone Encapsulation for LED: Ad-
vantages and Handling Precautions for more informa-
tion.
a. Do not poke sharp objects into the silicone
encapsulant. Sharp object like tweezers or syringes
might apply excessive force or even pierce through
the silicone and induce failures to the LED die or
wire bond.
b. Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result
in excessive stress on the wire bond. The LED should
only be held by the body.
c. Do no stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
d. Surface of silicone material attracts dusk and dirt
easier than epoxy due to its surface tackiness. To
remove foreign particles on the surface of silicone, a
cotton bud can be used with isopropyl alcohol (IPA).
During cleaning, rub the surface gently without
putting much pressure on the silicone. Ultrasonic
cleaning is not recommended.
e. For automated pick and place, Avago has tested
nozzle size below to be working ne with this LED.
However, due to the possibility of variations in other
parameters such as pick and place machine maker/
model and other settings of the machine, customer
is recommended to verify the nozzle selected will
not cause damage to the LED.
2. Handling of moisture sensitive device
This product has a Moisture Sensitive Level 3 rating
per JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
a. Before use
- An unopened moisture barrier bag (MBB) can
be stored at <40°C/90%RH for 12 months. If the
actual shelf life has exceeded 12 months and
the humidity Indicator Card (HIC) indicates that
baking is not required, then it is safe to reow the
LEDs per the original MSL rating.
- It is recommended that the MBB not be opened
prior to assembly (e.g. for IQC).
b. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all
times and all high temperature related processes
including soldering, curing or rework need to be
completed within 168 hours.
c. Control for unnished reel
- Unused LEDs must be stored in a sealed MBB
with desiccant or desiccator at <5%RH.
d. Control of assembled boards
- If the PCB soldered with the LEDs is to be
subjected to other high temperature processes,
the PCB need to be stored in sealed MBB with
desiccant or desiccator at <5%RH to ensure that
all LEDs have not exceeded their oor life of 168
hours.
e. Baking is required if:
- The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
- The LEDs are exposed to condition of >30°C /
60% RH at any time.
- The LED oor life exceeded 168hrs.
The recommended baking condition is: 60±5ºC
for 20hrs
Baking should only be done once.
f. Storage
- The soldering terminals of these Avago LEDs
are silver plated. If the LEDs are being exposed
in ambient environment for too long, the silver
plating might be oxidized and thus aecting its
solderability performance. As such, unused LEDs
must be kept in sealed MBB with desiccant or in
desiccator at <5%RH.
ID
Note: Diameter "ID" should
be bigger than 2.3mm