Datasheet

Figure 12. Recommended pick and place nozzle size Figure 13. Recommended Pb free re ow soldering pro le

217° C

200° C

60 - 120 SEC.

6° C / SEC. MAX.

3° C / SEC. MAX.

150° C

255 - 260° C

100 SEC. MAX.

10 to 30 SEC.

TIME

TEMPERATURE

(Acc. to J-STD-020C)

3° C / SEC. MAX.

Note: Diameter “D” should be smaller than 2.2 mm SMT LED Indicator

Components

Note: For detail information on re ow soldering of Avago surface mount

LEDs, do refer to Avago Application Note AN 1060 Surface Mounting

Figure 14. Recommended soldering pad pattern

CATHODE

MARKING

CATHODE

MARKING

A A

C C

SOLDER MASK

ANODE

CATHODE

0.4

0.3

MINIMUM 55 mm

OF CATHODE PAD

FOR IMPROVED HEAT DISSIPATION

2.4

0.6

0.9 X 6

4.6

1.4

1.3 x 6