Datasheet

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ASMT-Mxx4

Moonstone®

1W High Brightness Power LED Light Source

Data Sheet

Description

The Moonstone® 1W High Brightness Power LED Light

Source is a high performance energy ecient device

which can handle high thermal and high driving current.

The exposed pad design has excellent heat transfer from

the package to the motherboard.

The low prole package design is suitable for a wide variety

of applications especially where height is a constraint.

The package is compatible with reow soldering. This

will give more freedom and exibility to the light source

designer.

The 1W Power LED light source can be mounted onto

metal core PCB enabling optimum heat dissipation and

ease of installation.

Applications

• Sign backlight, billboard illumination or backlight

• Exit sign or emergency sign lightings

• Commercial lightings

• Accent and marker lightings

• Pathway lighting

• Task lighting

• Reading lights

• Decorative lighting

• Garden lighting

• Architectural lighting

• Portable (ash light, bicycle head light

Features

• Available in Cool White & Warm White color

• Energy ecient

• Exposed pad for excellent heat transfer

• Suitable for reow soldering process

• High current operation

• Long operation life

• Wide viewing angle

• Silicone encapsulation

• Non-ESD sensitive (threshold > 16KV)

• MSL 2a products

Specications

• InGaN Technology

• 3.5 V (max) at 350 mA

• 110° viewing angle

Summary of content (11 pages)

PAGE 1
ASMT-Mxx4 Moonstone® 1W High Brightness Power LED Light Source Data Sheet Description Features The Moonstone® 1W High Brightness Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. • Available in Cool White & Warm White color The low profile package design is suitable for a wide variety of applications especially where height is a constraint.
PAGE 2
Package Dimension for Moonstone® 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 1.27 Metal Slug 3 Ø 5.26 LED 10.60 + ZENER − 8.50 Ø 8.00 2.00 5.25 1.30 2 1 5.08 0.81 Figure 1. Moonstone® package outline drawing. Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±0.1 mm unless otherwise specified. 3. Terminal finish: Ag plating. Package Dimension for Moonstone® on MCPCB 16.00 1 2.50 Anode 60 ° 2 Cathode 3 Heat Sink ∅ 5.00 ∅ 3.00 20.00 14.00 ∅ 19.00 R 1.60 4.00 3.
PAGE 3
Part Numbering System ASMT-M x1 x2 4 - N x 3 x4 x5 x6 Packaging Option Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Moonstone®Type 0 – Non-diffused B – Diffused A - Non-diffused on MCPCB I C - Diffused on MCPCB I K - Non-diffused on MCPCB II L - Diffused on MCPCB II Color W – Cool White Y – Warm White Note: 1. Please refer to Page 9 for selection details. Device Selection Guide (Tj = 25°C) Max. Test Current (mA) Dice Technology Electrically Isolated Metal Slug 125.
PAGE 4
Absolute Maximum Ratings (TA = 25°C) Parameter ASMT-Mxx4 Units DC Forward Current [1] 350 mA Peak Pulsing Current 1000 mA Power Dissipation 1225 mW LED Junction Temperature 125 °C LED Junction Temperature for short term application 145 °C Operating Ambient Temperature Range -40 to +110 °C Storage Temperature Range -40 to +120 °C Soldering Temperature Refer to Figure 14 Reverse Voltage [2] Not recommended Notes: 1. Derate linearly based on Figure 11. 2.
PAGE 5
1.2 WARM WHITE 1.0 RELATIVE LUMINOUS FLUX (NORMALIZED AT 350mA) RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 COOL WHITE 480 580 WAVELENGTH - nm 680 NORMALIZED INTENSITY FORWARD CURRENT - mA 300 250 200 150 100 50 0 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V 3 3.5 4 Figure 6. Forward Current vs. Forward Voltage. PULSE CURRENT, IP - A 1.2 1.0 t D= p T 0 50 -60 1.4 tp T D= 0.05 0.10 0.25 0.50 1.00 IF 0.8 1.2 0.6 0.4 0.0 0.00001 0.0001 0.001 0.01 0.
PAGE 6
0.10 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) RELATIVE LIGHT OUTPUT (NORMALIZED AT 25°C) 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 WARM WHITE COOL WHITE 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C -0.05 -0.10 -0.15 -0.20 -0.25 400 400 350 350 300 250 200 RθJ-A = 30°C/W RθJ-A = 40°C/W RθJ-A = 50°C/W 150 100 50 0 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA - °C 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 Figure 11. Forward Voltage Shift vs.
PAGE 7
Option Selection Details Flux Bin Limit [x3, x4] Luminous Flux (lm) at IF = 350mA ASMT-Mx1 x2 4 - N x3 x4 x5 x6 x3 – Minimum Flux Bin x4 – Maximum Flux Bin x5 – Color Bin Selection x6 – Packaging Option Bin Min. Max. L 73.0 95.0 M 95.0 110.0 N 110.0 125.0 Tolerance for each bin limits is ±10%. Color Bin Selections [x5] Individual reel will contain parts from one full bin only.
PAGE 8
Color Bin Limit Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 Bin B X Y 0.362 0.372 0.356 0.330 Bin C X Y 0.329 0.369 Bin D X Y Bin E Warm White Color Limits (Chromaticity Coordinates) 0.329 0.369 Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 0.329 0.302 0.329 0.345 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 0.329 0.345 0.305 0.322 0.301 0.342 Bin C X Y 0.407 0.393 0.418 0.
PAGE 9
Packing Tube – Option 0 5.39 10.3 37.00 6.5 20.85 11.00 10.95 6.3 8.3 535.00 SIDE VIEW TOP VIEW Figure 18. Tube dimensions. Tape and Reel – Option 1 B Bo W F E A 2.5 B A Ko P SECTION A Dim Value AO 8.80 ±0.10 BO 16.45 ±0.10 KO 3.60 ±0.10 E 1.75 ±0.10 F 11.50 ±0.10 W 24.0 ±0.10 P 16.0 ±0.10 Quantity/ Reel 250 units All dimensions in millimeters. Ao SECTION B Figure 19. Carrier tape dimensions. END MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
PAGE 10
+1.00 24.0 −0.00 2.30 2.30 0 0º 60. ∅99.50 ± 1.00 R10.0 2.50 ± 0.50 ± .50 ∅268.00 R10 ∅13.50 ∅330.00 ± 1.00 120.0º Figure 21. Reel dimensions. Packing Tray – Option 0 (for Moonstone® on MCPCB only) Figure 22. Tray dimensions. 10 0 0.5 ± 0.
PAGE 11
Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information.