Datasheet

For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved.
AV02-2048EN - February 2, 2015
DISCLAIMER: Avagos products and software are not specically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights
to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use.
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone
is a soft material, please do not press on the silicone or
poke a sharp object onto the silicone. These might
damage the product and cause premature failure. During
assembly of handling, the unit should be held on the body
only. Please refer to Avago Application Note AN 5288 for
detail information.
Moisture Sensitivity
This product is qualied as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reli-
ability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
Unopen moisture barrier bag (MBB) can be stored at
< 40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reow the LEDs per the original MSL
rating.
It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
The LEDs must be kept at < 30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unnished reel
For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at < 5%RH.
D. Control of assembled boards
If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at < 5%RH to ensure no LEDs have
exceeded their oor life of 672 hours.
E. Baking is required if:
HIC “10%” indicator is NOT Brown and “5%” indicator
is Azure.
The LEDs are exposed to condition of > 30°C/60%RH
at any time.
The LED oor life exceeded 672 hrs.
Recommended baking condition: 60±5°C for 20 hrs.