Datasheet
9
APDS-9700 Moisture Proof Packaging
All APDS-9700 options are shipped in moisture proof package.
This part is compliant to JEDEC Level 1.
Recommended Storage Conditions
Storage Temperature The units in tape and reel are recommended to be kept in a controlled climate
environment, with temp at 25 +5/-10°C and relative humidity at 55 +/-15%.
Time from unsealing to soldering This part is compliant to JEDEC MSL-1 (unlimited oor life at < 30’C / 85%RH)
50
100 150 200 250 300
t-TIME
(SECONDS)
25
80
120
150
180
200
230
255
0
T - TEMPERATURE (°C)
R1
R2
R3
R4
R5
217
MAX 260C
60 sec to 90 sec
Above 217 C
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL DOWN
Recommended Reow Prole
The reow prole is a straight-line representation of a nominal temperature prole for a convective reow solder pro-
cess. The temperature prole is divided into four process zones, each with dierent DT/Dtime temperature change rates
or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the com-
ponent to printed circuit board connections.
In process zone P1, the PC board and APDS-9700 pins are heated to a temperature of 150°C to activate the ux in the
solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC
board and APDS-9700 pins.
Process zone P2 should be of sucient time duration (100 to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder, usually 200°C (392°F).
Process zone P3 is the solder reow zone. In zone P3, the temperature is quickly raised above the liquidus point of sol-
der to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and
40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the
formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder
connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then
rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within
the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C
(77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9700
pins to change dimensions evenly, putting minimal stresses on the APDS-9700.
It is recommended to perform reow soldering no more than twice.