Datasheet

3
Solder Reow Temperature Prole
0
TIME (SECONDS)
TEMPERATURE ( °C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5 °C/SEC.
3°C + 1 °C/- 0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3 °C + 1 °C/- 0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5 °C/SEC.
DIMENSIONS IN MILLIMETERS AND (INCHES)
8.27
(0.325)
2.0
(0.080)
2.5
(0.10)
1.3
(0.05)
0.64
(0.025)
4.4
(0.17)
Land Pattern Recommendation
Recommended Pb-Free IR Prole
Note: Non-halide ux should be used.
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3
°
C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5°C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NO TES:
THE TIME FROM 25°C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide ux should be used.