Datasheet

3
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25 °C
150 °C
200 °C
250 °C
260 °C (Peak Temperature)
217 °C
Time (sec)
Temperature (
°
C)
Solder Reow Temperature Prole
1. One-time soldering reow is recommended within the
condition of temperature and time prole shown at
right.
2. When using another soldering method such as
infrared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
Note: Non halide ux should be used.
Absolute Maximum Ratings
Parameter Symbol ACPL-217 Units Note
Storage Temperature T
S
-55~125 °C
Operating Temperature T
A
-55~110 °C
Average Forward Current I
F(AVG)
50 mA
Pulse Forward Current I
FSM
1 A
Reverse Voltage V
R
6 V
LED Power Dissipation P
I
65 mW
Collector Current I
C
50 mA
Collector-Emitter Voltage V
CEO
80 V
Emitter-Collector Voltage V
ECO
7 V
Isolation Voltage (AC for 1min, R.H. 40~60%) V
ISO
3000 V
RMS
1min
Collector Power Dissipation P
C
150 mW
Total Power Dissipation P
TOT
200 mW
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane