Datasheet

2
Selection for lower input current
down to 250 µA is available upon
request.
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creep-
age and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
Widebody
8-Pin DIP Package Hermetic
(300 Mil) Small Outline SO-8 (400 mil) Single and
Dual Single Dual Minimum Absolute Dual
Single Channel Channel Channel Single Input ON Maxi- Channel
Channel Package Package Package Channel Current Minimum mum Packages
Package HCPL- HCPL- HCPL- Package (I
F
) CTR V
CC
HCPL-
6N139 2731
[1]
0701 0731 HCNW139 0.5 mA 400% 18 V
6N138 2730
[1]
0700 0730 HCNW138 1.6 mA 300% 7 V
HCPL-4701
[1]
4731
[1]
070A
[1]
073A
[1]
40 µA 800% 18 V
0.5 mA 300% 20 V 5701
[1]
5700
[1]
5731
[1]
5730
[1]
Note:
1. Technical data are on separate Avago publications.