Datasheet

■ Portable memory
■ LCD monitors
■ Disk drives
■ PDAs
■ Digital cameras
■ DVDs
■ Cell phones
■ Rechargeable battery packs
■ Battery chargers
■ Set top boxes
■ Industrial controllers
SF-0603F Series - Fast Acting Surface Mount Fuses
Solder Refl ow Recommendations
Peak: 250 +0/-5 °C
230 °C or higher
PRE-HEATING ZONE
SOLDERING ZONE
HEATING TIME
180 °C
250
200
150
TEMPERATURE (°C)
100
50
150 °C
90 ± 30 Seconds
30 ± 10 Seconds
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
Product Dimensions Recommended Pad Layout
DIMENSIONS:
MM
(INCHES)
Thermal Derating Curve
120
110
100
90
80
-20 0 20 40
AMBIENT TEMPERATURE (°C)
PERCENT OF RATING (%)
60 80 100 120
Construction & Material Content
OVERCOAT
Sn PLATING
CERAMIC SUBSTRATE
FUSE ELEMENT
Cu / Ni PLATING
PACKAGING: 5,000 pcs./reel
1.6 ± 0.1
(.063 ± .004)
0.3 ± 0.2
(.012 ± .008)
0.3 ± 0.2
(.012 ± .008)
0.8 ± 0.1
(.031 ± .004)
0.35 ± 0.2
(.014 ± .008)
0.35 ± 0.2
(.014 ± .008)
0.45 ± 0.1
(.018 ± .004)
1.09
(.043)
2.54
(.010)
1.02
(.040)
SinglFuse
™
SF-0603F Series Applications
Operating Temperature ..................................................................................-40 °C to +105 °C
Storage Conditions
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.