Datasheet

Solder Reflow Recommendations
160–220
300
250
200
150
100
50
0
10–20
Temperature (°C)
120
Preheating Soldering Cooling
Time (seconds)
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
• A device should not be reworked.
CMF-SDP SERIES, REV. C, 11/08
CMF-SDP Series - Telecom CPTC Resettable Fuses
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Product Dimensions
Recommended Pad LayoutRecommended Pad Layout
Packaging options: TAPE & REEL: 350 pcs. per reel Packaging options: TAPE & REEL: 400 pcs. per reel
MM
(INCHES)
DIMENSIONS =
8.75
(.344)
MAX.
MAX.
MAX.
7.2
(.283)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
CMF-SDP10A, 25A, 35A & 50A
5.0
(.197)
11.0
(.433)
MAX.
9.0
(.354)
MAX.
11.5
(.453)
MAX.
2.6
(.102)
CMF-SDP07, 10, 25, 35, 50 & 75
7.2
(.283)
MAX.
8.75
(.344)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
9.0
(.354)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
7.6
(.299)
11.0
(.433)
5.0
(.197)