Data Sheet
ChipGuard
®
MLC Series - ESD Protectors
Product Dimensions
CG0402 CG0603
Dimension Series Series
L
1.00 ± 0.15 1.60 ± 0.20
(0.04 ± 0.006) (0.064 ± 0.008)
W
0.50 ± 0.10 0.80 ± 0.20
(0.02 ± 0.004) (0.032 ± 0.008)
A
0.36 ± 0.05 0.45 ± 0.10
(0.014 ± 0.002) (0.018 ± 0.004)
B
0.25 ± 0.15 0.30 ± 0.20
(0.10 ± 0.006) (0.012 ± 0.008)
DIMENSIONS:
MM
(INCHES)
Recommended Pad Layout
Solder Reow Recommendations
110 sec. (min.)
300
250
200
150
100
50
0
30-70
sec.
Temperature (ϒC)
120 sec. (min.)
Preheat Stages 1-3 Soldering Cooling
Time (seconds)
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
A Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s
C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s
D Main Heating 200 °C 60 s to 70 s
210 °C 55 s to 65 s
220 °C 50 s to 60 s
230 °C 40 s to 50 s
240 °C 30 s to 40 s
250 °C to 255 °C 5 s
E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s
CG0402 CG0603
Dim. Series Series
A
0.51 0.76
(0.020) (0.030)
B
0.61 1.02
(0.024) (0.040)
C
0.51 0.50
(0.020) (0.020)
D
1.70 2.54
(0.067) (0.100)
L
B
A
W
A
C
B
D
L
B
A
W
A
C
B
D
L
B
A
W
A
C
B
D
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.