Datasheet

REV. 01/19
3312 - 2 mm SMD Trimming Potentiometer
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
BPS130 Series - 10 mm Analog High Pressure Sensor
Solder Prole
300
250 °C Max.
(5 Seconds Max.)
150 ±5 °C
Time
200
100
80-100 Seconds
Processing Method: Reflow soldering with infrared heat or forced air convection (only once).
60 Seconds Max.
TEMPERATURE (°C)
Notes:
1. No clean solder paste is recommended.
2. Aqueous wash is not recommended.
3. Use of water soluble soldering ux
should be avoided due to possible
corrosion.
4. Multiple passes through the soldering
process is not recommended.
5. Other SMD processes and proles
should be veried by the customer.
250 pieces per 13-inch reel.
Meets specications of EIA-481-1 or EIA-481-2.
Packaging Specication
DIMENSIONS:
MM
(INCHES)
TOLERANCES:
0.25
(0.010)
25.4
(1.0)
29.21
(1.15)
330.2
(13.0)
DIA.
20.32
(0.8)
DIA.
12.7
(0.5)
DIA.
101.6
(4.0)
24.0
(0.945)
11.5
(0.453)
3.81
(0.15)
EQUAL SPACED
3 PLCS.
2.0
(0.079)
4.0
(0.157)
16.0
(0.630)