Datasheet

Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
3382 - 12 mm Rotary Position Sensor
Processing Information
Process Description Materials Temperature Time Interval
1. Apply solder paste to test board • Sn/Ag/Cu Alloy water Room temperature
(8 - 10 mil thick) soluble or no clean solder
paste
• Single sided epoxy glass
(G10) (UL approved)
• PC board approx. 4x4x.06 in.
2. Place test units onto board 6 units/board
3. Ramp up Convection oven 2.5 °C ±0.5 °/second
4. Preheat 150 °C to 190 °C 90 ±30 seconds
5. Time above liquidus 220 °C 60-90 seconds
6. Peak temperature 260 °C +0 °/-5 °
10-20 sec. within 5 °C of peak
7. Ramp down Room temperature 3 °C ±0.5 °C/second
300
255
TEMPERATURE (°C)
220
190
150
0
0 50 100 150
TIME (SECONDS)
200 250
Rotor Dimensions
-1
-2
ORIENTATION FEATURE
4.0 +0.102/-0.051
(.158 +.004/-.002)
DIA.
3.023 ± 0.05
(.119 ± .002)
2.97 ± 0.05
(.117 ± .002)
1.02
(.040)
0.52
(.060)
ORIENTATION FEATURE
3.51 ± 0.05
(.138 ± .002)
DIA.
2.515 ± 0.05
(.099 ± .002)
2.438 ± 0.05
(.096 ± .002)
0.76
(.030))
0.52
(.060)