Specifications

BMA180
Preliminary data sheet
Bosch Sensortec
Rev. 1.0 Page 75 / - proprietary information - 06 March 2009
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Specifications within this document are preliminary and subject to change without notice. Document is not intended for publication.
11.4 Landing pattern recommendations
The following PCB design is recommended in order to minimize solder voids and stress acting
on the sensing element. All dimensions are given in mm.
11.5 Moisture sensitivity level and soldering
The moisture sensitivity level of the BMA180 sensors corresponds to JEDEC Level 1, see also
IPC/JEDEC J-STD-020C "Joint Industry Standard: Moisture/Reflow Sensitivity Classification for
non-hermetic Solid State Surface Mount Devices"
and
IPC/JEDEC J-STD-033A "Joint Industry Standard: Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices".
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC
standard, i.e. reflow soldering with a peak temperature up to 260°C (see: Handling, soldering &
mounting instructions)