Specifications

BMA180
Preliminary data sheet
Bosch Sensortec
Rev. 1.0 Page 7 / - proprietary information - 06 March 2009
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Specifications within this document are preliminary and subject to change without notice. Document is not intended for publication.
8.1 SPECIFICATION OF INTERFACE PARAMETERS .................................................................................. 58
8.2 INTERFACE SELECTION ................................................................................................................. 58
8.3 I²C INTERFACE............................................................................................................................. 59
8.3.1 I²C timings............................................................................................................................. 59
8.3.2 Start and stop conditions...................................................................................................... 60
8.3.3 Bit transfer............................................................................................................................. 60
8.3.4 Acknowledge ........................................................................................................................ 61
8.3.5 I
2
C protocol........................................................................................................................... 61
8.4 SPI INTERFACE (4-WIRE).............................................................................................................. 63
8.4.1 SPI protocol .......................................................................................................................... 63
8.4.2 SPI timings............................................................................................................................ 64
9 APPLICATION EXAMPLES............................................................................................................... 65
9.1 WAKE-UP/FREE-FALL DETECTION .................................................................................................. 65
9.2 DETERMINATION OF ORIENTATIONS................................................................................................ 65
9.3 TILT MEASUREMENTS ................................................................................................................... 65
9.4 DEAD RECKONING BY DOUBLE INTEGRATION................................................................................... 65
9.4.1 Offset re-calibration .............................................................................................................. 65
9.4.2 Sensitivity/TCO/TCS re-calibration/software.........................................................................67
10 PINNING.......................................................................................................................................... 68
10.1 PIN CONFIGURATION (TOP VIEW) ................................................................................................ 68
10.2 PINNING: ELECTRICAL CONNECTIONS IN CASE OF SPI OR I²C OR NO µC) ....................................... 68
10.3 EXTERNAL COMPONENT CONNECTION DIAGRAM .......................................................................... 70
11 PACKAGE....................................................................................................................................... 72
11.1 OUTLINE DIMENSIONS ............................................................................................................... 72
11.2 ORIENTATION: POLARITY OF THE ACCELERATION OUTPUT............................................................. 72
11.3 MARKING................................................................................................................................. 74
11.3.1 Mass production samples..................................................................................................... 74
11.3.2 Engineering samples............................................................................................................ 74
11.4 LANDING PATTERN RECOMMENDATIONS ..................................................................................... 75
11.5 MOISTURE SENSITIVITY LEVEL AND SOLDERING ........................................................................... 75
11.6 ROHS COMPLIANCY ................................................................................................................. 76
11.7 TAPE AND REEL........................................................................................................................ 76
11.8 HANDLING INSTRUCTION ........................................................................................................... 76
11.9 FURTHER HANDLING, SOLDERING AND MOUNTING INSTRUCTIONS .................................................. 76
12 LEGAL DISCLAIMER..................................................................................................................... 77
12.1 ENGINEERING SAMPLES ............................................................................................................ 77
12.2 PRODUCT USE.......................................................................................................................... 77
12.3 APPLICATION EXAMPLES AND HINTS ........................................................................................... 77
12.4 LIMITING VALUES ...................................................................................................................... 77
13 DOCUMENT HISTORY AND MODIFICATION............................................................................... 78