Information
BMA280
Data sheet
Page 2
BST-BMA280-DS000-11 | Revision 1.8 | August 2014 Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
BMA280
14 BIT, DIGITAL, TRIAXIAL ACCELERATION SENSOR WITH INTELLIGENT
ON-CHIP MOTION-TRIGGERED INTERRUPT CONTROLLER
Key features
Ultra-Small package LGA package (12 pins), footprint 2mm x 2mm,
height 0.95mm
Digital interface SPI (4-wire, 3-wire), I²C, 2 interrupt pins
V
DDIO
voltage range: 1.2V to 3.6V
Programmable functionality Acceleration ranges ±2g/±4g/±8g/±16g
Low-pass filter bandwidths 500Hz - <8Hz
up to an max. output data read out of 2kHz (unfiltered)
On-chip FIFO Integrated FIFO with a depth of 32 frames
On-chip interrupt controller Motion-triggered interrupt-signal generation for
- new data
- any-motion (slope) detection
- tap sensing (single tap / double tap)
- orientation recognition
- flat detection
- low-g/high-g detection
- no-motion / inactivity detection
Ultra-low power Low current consumption, short wake-up time,
advanced features for system power management
Temperature sensor
RoHS compliant, halogen-free
Typical applications
Display profile switching
Menu scrolling, tap / double tap sensing
Gaming
Pedometer / step counting
Free-fall detection
E-compass tilt compensation
Drop detection for warranty logging
Advanced system power management for mobile applications
General description
The BMA280 is a triaxial, low-g acceleration sensor with digital output for consumer
applications. It allows measurements of acceleration in three perpendicular axes. An evaluation
circuitry (ASIC) converts the output of a micromechanical acceleration-sensing structure
(MEMS) that works according to the differential capacitance principle.
Package and interfaces of the BMA280 have been defined to match a multitude of hardware
requirements. Since the sensor features an ultra-small footprint and a flat package it is
ingeniously suited for mobile applications.