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2.2 PH

PVIN

SGND PGND

SW1 SW2

LM3269

VOUT

VCON

RF PA

OUT

: 0.6V to 4.2V

4.7 PF

10 PF

BATT

: 2.7V to 5.5V

GPO1

DAC

RFIC

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LM3269

SNVS793D –NOVEMBER 2011–REVISED MAY 2015

LM3269 Seamless-Transition Buck-Boost Converter

for 3G and 4G RF Power Amplifiers

1 Features 3 Description

The LM3269 is buck-boost DC-DC converter

• Operates From a Single Li-Ion Cell: 2.7 V to 5.5 V

designed to generate output voltages above or below

• Adjustable Output Voltage: 0.6 V to 4.2 V

a given input voltage and is particularly suitable for

• Automatic PFM or PWM Mode Change

portable applications powered by a single-cell Li-ion

battery.

• 750-mA Maximum Load Capability for

BATT

≥ 3 V, V

OUT

= 3.8 V

The LM3269 operates at a 2.4-MHz typical switching

• 2.4-MHz (typical) Switching Frequency

frequency in full synchronous operation and provides

seamless transitions between buck and boost

• Seamless Buck-Boost Mode Transition

operating regimes. The LM3269 operates in energy-

• Fast Output Voltage Transition: 1.4 V to 3 V

saving Pulse Frequency Modulation (PFM) mode for

in 10 µs

increased efficiencies and current savings during low-

• High-Efficiency: 95% typical at V

BATT

= 3.7 V,

power RF transmission modes.

OUT

= 3.3 V, at 300 mA

The power converter topology needs only one

• Input Overcurrent Limit

inductor and two capacitors. A unique internal power

switch topology enables high overall efficiency.

• Internal Compensation

The LM3269 is internally compensated for buck and

2 Applications

boost modes of operation, thus providing an optimal

transient response.

• Power Supply for 3G/4G Power Amplifiers

• Cellular Phones

When considering using the LM3269 in a system

design, please review the layout instruactions at the

• Portable Hard Disk Drives

end of this document.

• PDAs

Device Information

(1)

PART NUMBER PACKAGE BODY SIZE (MAX)

LM3269 DSBGA (12) 2.529 mm x 2.022 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Typical Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

Summary of content (27 pages)

PAGE 1
Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 LM3269 Seamless-Transition Buck-Boost Converter for 3G and 4G RF Power Amplifiers 1 Features 3 Description • • • • The LM3269 is buck-boost DC-DC converter designed to generate output voltages above or below a given input voltage and is particularly suitable for portable applications powered by a single-cell Li-ion battery.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications.................................................
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 5 Pin Configuration and Functions YZR Package 12-Pin DSBGA Top View A1 A2 A3 A3 A2 A1 B1 B2 B3 B3 B2 B1 C1 C2 C3 C3 C2 C1 D1 D2 D3 D3 D2 D1 Top View Bottom View Pin Functions PIN NUMBER NAME A1 NC (1) TYPE (1) DESCRIPTION — Non Connection. Leave this pin floating; do not connect to PVIN or PGND. A2 NC — Non Connection. Leave this pin floating, do not connect to PVIN or PGND.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) PVIN, VOUT to GND MIN MAX −0.2 6 UNIT V (3) V EN, VCON to SGND, PGND −0.2 PVIN + 0.2 V or 6 V FB to PGND −0.2 VOUT + 0.2 V or 6 V (3) V SW1, SW2 −0.2 PVIN + 0.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 6.5 Electrical Characteristics Unless otherwise specified, typical (TYP) limits are for TA = TJ = 25°C, and minimum (MIN) and maximum (MAX) limits apply over the full operating ambient temperature range (−30°C ≤ TJ = TA ≤ +85°C). Unless otherwise noted, specifications apply to the Figure 16 with: PVIN = EN = 3.6V. (1) (2) MIN TYP MAX VFB, min Min FB voltage PARAMETER VCON = 0.2 V 0.53 0.60 0.67 VFB, max Max FB voltage VCON = 1.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com System Characteristics (continued) The following spec table entries are specified by design and verification provided the component values in the typical application circuit are used (L = 2.2 µH, DCR = 110 mΩ, MIPSZ2520D2R2/FDK; CIN = 10 µF, 6.3 V, C1608X5R0J106K/TDK (0603); COUT = 4.7 µF, 6.3 V, C1608X5R0J475M/TDK (0603). These parameters are not verified by production testing.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 6.8 Typical Characteristics (PVIN = EN = 3.6 V and TA = 25°C, unless otherwise noted) VCON = VOUT = SW1 = SW2 = EN = 0 V VOUT = 3.5 V Figure 1. Shutdown Current vs. Temperature IOUT = 300 mA Figure 2. Switching Frequency vs. Temperature 100 90 EFFICIENCY (%) 80 70 60 50 40 30 PVIN = 2.7V PVIN = 3.0V PVIN = 3.6V PVIN = 4.2V PVIN = 4.8V 20 10 0 0 20 40 60 80 100 OUTPUT LOAD (mA) 120 VOUT = 0.6 V Figure 4.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com Typical Characteristics (continued) 100 100 90 90 80 70 60 PVIN = 2.7V PVIN = 3.0V PVIN = 3.6V PVIN = 4.2V 50 EFFICIENCY (%) EFFICIENCY (%) (PVIN = EN = 3.6 V and TA = 25°C, unless otherwise noted) 70 60 PVIN = 2.7V PVIN = 3.0V PVIN = 3.6V PVIN = 4.2V 50 40 40 0 100 200 300 400 500 600 700 OUTPUT LOAD (mA) VOUT = 2.4 V 0 100 200 300 400 500 600 700 OUTPUT LOAD (mA) VOUT = 3.6 V Figure 7. PWM Efficiency 8 80 Figure 8.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 7 Detailed Description 7.1 Overview The LM3269 buck-boost converter provides high-efficiency, low-noise power for RF power amplifiers (PAs) in mobile phones, portable communicators, and similar battery-powered RF devices. It is designed to allow the RF PA to operate at maximum efficiency for a wide range of power levels from a single Li-Ion battery cell.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com 7.3 Feature Description 7.3.1 Dynamically Adjustable Output Voltage The LM3269 features a dynamically adjustable output voltage to eliminate the need for external feedback resistors. The output can be set from 0.6 V to 4.2 V by changing the voltage on the analog VCON pin. This feature is useful in cell phone RF PA applications where peak power is needed only when the handset is far away from the base station or when data is being transmitted.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information 8.1.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com Typical Application (continued) 8.2.1 Design Requirements DESIGN PARAMETER EXAMPLE VALUE Minimum input voltage 2.7 V Minimum output voltage 0.6 V Output current 0 to 750 mA Switching frequency 2.4 MHz (typical) 8.2.2 Detailed Design Procedure 8.2.2.1 Recommended External Components 8.2.2.1.1 Inductor Selection A 2.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 Table 3. Suggested Capacitors MODEL VENDOR 10 µF for CIN C1608X5R0J106K (0603) TDK CL05A106MQ5NUN (0402) Samsung C1608X5R0J475M (0603) TDK CL05A475MQ5NRN (0402) Samsung C1005X5RR0J475M (0402) TDK 4.7 µF for COUT 8.2.3 Application Curves PVIN = 3.7 V VOUT = 0.8 V↔ 2 V RLOAD = 20 Ω PVIN= 3.7 V VOUT = 3.45 V Load = 500 mA Load = 500 mA Figure 10. Buck Mode Operation Figure 9. VOUT Transient Response (PFM ↔ PWM) PVIN = 3.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 PVIN = 3.6 V VOUT = 3.45 V www.ti.com Load = 350 mA PVIN Step = 3.6 V ↔ 4.2 V Figure 13. Start-Up VOUT = 3 V Load = 320 mA Figure 14. Line Transient For DC-DC PVIN = 3.8 V VOUT = 3.45 V Figure 15. Load Transient DC-DC 9 Power Supply Recommendations The LM3269 device is designed to operate from an input voltage supply range between 2.7 V and 5.5 V. This input supply should be well regulated.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 10 Layout 10.1 Layout Guidelines 10.1.1 Overview PC board layout is critical to successfully designing a DC-DC converter into a product. A properly planned board layout optimizes the performance of a DC-DC converter and minimizes effects on surrounding circuitry while also addressing manufacturing issues that can have adverse impact on board quality and final product yield. 10.1.1.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com Layout Guidelines (continued) 10.1.1.2 Manufacturing Considerations The LM3269 package employs a 12-bump (4 x 3) array of 300 micron solder balls, with a 0.5 mm pad pitch. A few simple design rules will go a long way toward ensuring a good layout. • Pad size should be 0.265 ± 0.02 mm. Solder mask opening should be 0.375 ± 0.02 mm. • As a thermal relief, connect to each pad with 9.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 C2 C1 L2 10.1.1.4 Component Placement PVIN SW1 PGND NC EN SGND SW2 NC VCON FB VOUT C3 L1 LM3269 PVIN C4 Figure 17. LM3269 Recommended Parts Placement (Top View) 10.1.1.5 PCB Considerations By Layer 10.1.1.5.1 VBATT Use a star connection from VBATT to LM3269 and VBATT to PA VBATT (VCC1) connection. Do not daisy-chain VBATT connection to LM3269 circuit and then to PA device VBATT connection. 1. 2. 3. 4. 5. 6.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com 10.2 Layout Examples Figure 18. Top Layer Figure 19.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 Layout Examples (continued) Figure 20. Board Layer 3 - SW Routing Figure 21.
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LM3269 SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 www.ti.com 10.3 DSBGA Package Assembly And Use Use of the DSBGA package requires specialized board layout, precision mounting, and careful re-flow techniques, as detailed in Texas Instruments Application Note 1112. Refer to the section Surface Mount Technology (SMD) Assembly Considerations. For best results in assembly, alignment ordinals on the PC board should be used to facilitate placement of the device.
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LM3269 www.ti.com SNVS793D – NOVEMBER 2011 – REVISED MAY 2015 11 Device and Documentation Support 11.1 Device Support 11.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 11.2 Documentation Support 11.2.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM3269TLE/NOPB DSBGA YZR 12 250 178.0 8.4 LM3269TLX/NOPB DSBGA YZR 12 3000 178.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.18 2.69 0.76 4.0 8.0 Q1 2.18 2.69 0.76 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3269TLE/NOPB DSBGA YZR LM3269TLX/NOPB DSBGA YZR 12 250 210.0 185.0 35.0 12 3000 210.0 185.0 35.
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MECHANICAL DATA YZR0012xxx 0.600±0.075 D E TLA12XXX (Rev C) D: Max = 2.529 mm, Min =2.469 mm E: Max = 2.022 mm, Min =1.961 mm 4215049/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.
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